Redistributed Chip Package Dummy Die Warping Control
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Solution Overview
Problem
Semiconductor device encapsulation layers tend to warp during processing, making it difficult to hold them in tools for subsequent operations, and using expensive ceramic stiffening plates or slow adhesive dissolution methods can lengthen processing times and damage components.
Innovation Solution
The use of a dummy die structure with identical expansion and contraction characteristics to the active die structure, encapsulated together with the active die structure, allows for secure mounting and reduced warping, using temporary support members and specific adhesive tapes to facilitate processing without the need for costly ceramic plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the encapsulation layer is secured to a stiffening plate using adhesive, then warping is reduced, but processing time increases and components may be damaged
Solution Approach 1:
The patent uses a temporary support member made of inexpensive material that is discarded after serving its purpose of preventing warping during processing. This disposable approach eliminates the need for expensive ceramic plates and lengthy adhesive dissolution steps, directly reducing processing time while maintaining encapsulation layer stability during the critical processing period.
Solution Approach 2:
The temporary support member is attached to the back of the encapsulation layer before processing operations begin. This preliminary action prevents warping from occurring in the first place during subsequent processing steps, eliminating the need for post-processing corrective measures and reducing overall processing time.
2Stability of the object's composition
If expensive ceramic stiffening plates are used, then warping is reduced, but processing cost increases
Solution Approach 1:
The patent replaces expensive ceramic stiffening plates with inexpensive temporary support members that are discarded after use. This substitution dramatically reduces manufacturing costs while maintaining the essential function of preventing warping during processing. The temporary support member serves its purpose and is then removed without needing to be reused or recovered.
Solution Approach 2:
The patent creates a simplified copy of the stiffening function using a temporary support member instead of the traditional expensive ceramic plate. This copy performs the essential warping-prevention function during processing but is designed to be temporary and disposable, eliminating the need for expensive materials while maintaining functional equivalence during the critical processing period.
3Ease of operation
If adhesive dissolution is used to detach the panel, then the encapsulation layer is released, but processing time lengthens and components are deteriorated
Solution Approach 1:
The temporary support member is designed to be easily removable after serving its purpose, eliminating the need for lengthy adhesive dissolution steps. The support member can be detached quickly without requiring chemical processes that damage components, directly reducing processing time while maintaining ease of operation.
Solution Approach 2:
The patent employs a disposable temporary support member that is discarded after detachment rather than recovered or reused. This approach eliminates the need for complex dissolution processes and allows for quick removal, reducing processing time while avoiding damage to the encapsulation layer and other components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces deformation of the encapsulation layer, enabling uniform processing and reducing processing time while protecting other components from damage, by maintaining planarity and allowing for efficient singulation and redistribution layer build-up.
Implementation Method 1
secured to a stiffening plate using an adhesive
Implementation Method 2
the encapsulation layer is subject to degrees of warping which interfere with holding it in a tool to perform subsequent processing operations
Data Source
AI summary
A method of assembling Redistributed Chip Package (RCP) semiconductor devices. An active die structure is encapsulated in a molding compound with internal electrical contacts of the active die structure positioned at an active face of an encapsulation layer. A dummy die structure is positioned at a back face of the encapsulation layer. A redistribution layer is formed at an active face of the encapsulation layer. The redistribution layer includes a layer of insulating material and redistribution electrical interconnections. The insulating material is built up with grooves along saw streets. External electrical contacts exposed at a surface of the redistribution layer are connected with the redistribution electrical interconnections. The dummy die structure is removed and then the semiconductor devices are singulated.