Rear Bonding Structure for Seamless Tiled Display Panels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Tiled display devices experience a decrease in display quality due to visible seam-lines when sub-display panels with peripheral areas are combined, as the size of these peripheral areas cannot be minimized effectively, affecting the overall display quality and user experience.
Innovation Solution
A rear bonding structure and manufacturing method involving a sacrificial layer, pad electrodes, and a conductive film are used to minimize the peripheral area, ensuring seamless integration of sub-display panels by forming openings in the base layer that expose the pad electrodes and allowing for the attachment of a conductive film, which electrically connects the panels without visible boundaries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sub-display panels with peripheral areas are combined to form a tiled display device, then the display device can be manufactured with modular sub-panels, but visible seam-lines appear at the boundaries reducing display quality
Solution Approach 1:
The peripheral area containing the bonding structure is extracted and removed from the final display panel. A sacrificial layer is formed in the peripheral area, which is then removed to create openings that expose pad electrodes. This extraction of the peripheral bonding structure eliminates the visible seam-lines while maintaining the benefits of modular manufacturing.
Solution Approach 2:
The sacrificial layer is formed and positioned in advance during the manufacturing process, before the bonding structures are attached. This preliminary placement allows for precise positioning of the bonding areas and ensures that the peripheral structures are ready for subsequent bonding operations, improving both manufacturing ease and final display quality.
2Manufacturing precision
If the peripheral area size is reduced to minimize seam-lines, then display quality improves, but the structural integrity and electrical connection reliability may be compromised
Solution Approach 1:
The bonding structures are nested within the peripheral area of the display panel, with the sacrificial layer containing the bonding structures that are attached to the pad electrodes. This nesting arrangement allows the bonding structures to be positioned precisely within the peripheral region, maintaining electrical connection reliability while minimizing the visible peripheral area and seam-lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and display quality of tiled display devices by minimizing the peripheral areas between sub-display panels, making the boundaries between adjacent panels unrecognizable and improving the overall visual experience.
Implementation Method 1
the sacrificial layer is removed using a fluorine-based solvent
Implementation Method 2
attaching a conductive film in the opening of the first base layer where the conductive film contacts the pad electrodes
Data Source
AI summary
A method of manufacturing a display device includes forming a sacrificial layer on a carrier substrate, forming a first base layer on the carrier substrate that surrounds the sacrificial layer and includes a different material from the sacrificial layer, forming pad electrodes on the first base layer that contact the sacrificial layer, forming a pixel structure on the first base layer that is electrically connected to the pad electrodes, separating the carrier substrate from the first base layer and the sacrificial layer, removing the sacrificial layer to expose the pad electrodes, and attaching a conductive film under the pad electrodes that contacts the pad electrodes.