Rear-Surface Display Panel Bonding With Through-Base Metal Pattern
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Solution Overview
Problem
Existing display devices face challenges in minimizing non-display areas and simplifying manufacturing processes while maintaining effective electrical connections between the display panel and the circuit board.
Innovation Solution
A display device design that includes a display panel with a base layer and a circuit layer, featuring a pad electrode exposed through a first opening in the base layer, and a metal pattern that electrically connects the pad electrode to the circuit board. This design allows for rear-surface bonding of the circuit board to the display panel without bending the non-display area, reducing defects and bezel area requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the circuit board is bonded to the rear surface of the display panel without bending the non-display area, then defects associated with bending are reduced, but the manufacturing process complexity increases due to the need for precise alignment and additional bonding steps
Solution Approach 1:
The base layer is divided into a display area and a non-display area, with the metal pattern selectively positioned in the non-display area to establish electrical connections without requiring bending of the display area. This segmentation allows the circuit board to be bonded to the rear surface while keeping the display area flat and defect-free.
Solution Approach 2:
The electrical connection is established by extending the metal pattern from the front surface through the base layer to the rear surface, utilizing the third dimension (depth) to create through-opening connections. This eliminates the need for bending in the horizontal plane and allows rear-surface bonding while maintaining display area integrity.
2Area of stationary object
If the non-display area is reduced, then the bezel area requirements are minimized, but the manufacturing precision requirements increase to ensure proper alignment of the metal pattern with the pad electrode
Solution Approach 1:
The metal pattern is formed to extend through the base layer before the circuit board is bonded. This preliminary formation of the through-opening metal pattern ensures that the electrical connection path is already established and aligned with the pad electrode, reducing the precision requirements during the subsequent bonding process.
Solution Approach 2:
The metal pattern acts as an intermediary element that bridges the pad electrode on the front surface and the circuit board on the rear surface. By providing this intermediate connection structure within the base layer, the alignment requirements between the pad electrode and circuit board are relaxed, as the metal pattern absorbs some of the alignment tolerance.
3Ease of manufacture
If a connection electrode is eliminated between the pad electrodes and metal patterns, then the manufacturing process is simplified, but the electrical connection reliability may be compromised
Solution Approach 1:
The metal pattern is designed to directly contact the pad electrode without an intermediate connection electrode. The metal pattern extends from the rear surface through the base layer and makes direct electrical contact with the pad electrode on the front surface, merging the connection function into a single continuous conductive structure that simplifies manufacturing while maintaining reliability.
Solution Approach 2:
The metal pattern performs multiple functions: it provides electrical connection from the rear surface to the front surface, serves as a bonding interface for the circuit board, and directly contacts the pad electrode without requiring a separate connection electrode. This multi-functionality eliminates unnecessary components and simplifies the manufacturing process while maintaining electrical connection reliability.
Data Source
AI summary
A display device includes a display panel displaying an image, a circuit board coupled with the display panel, and a metal pattern electrically connecting the display panel and the circuit board. The display panel includes a base layer and a circuit layer disposed on the base layer and including a pad electrode exposed to an outside via an opening defined through the base layer. The metal pattern includes a first portion overlapping the opening and being in contact with the pad electrode and a second portion that does not overlap the opening and is in contact with the circuit board.