Recessed Chip Resistor Layout for High-Power Thermal Conduction
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Solution Overview
Problem
Conventional chip resistors face issues with heat generation and heat dissipation, particularly when handling high power, as the temperature of the resistance member increases, and only a portion of the resistance member in contact with the substrate dissipates heat effectively.
Innovation Solution
A chip resistor design featuring an insulating substrate with a recessed area for the resistance member, increasing the contact area between the resistance member and the substrate, allowing for enhanced heat dissipation, and incorporating trimming grooves to adjust resistance values accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the resistance member is made to handle high power, then the power handling capability is improved, but the temperature of the resistance member increases excessively
Solution Approach 1:
The resistance member is positioned in a recessed structure that extends into the substrate, transitioning from a purely surface-level configuration to a three-dimensional arrangement. This allows heat to dissipate into the substrate volume rather than being confined to the surface, effectively using the third dimension (depth) to improve thermal management while maintaining high power handling capability
Solution Approach 2:
The recessed structure acts as an intermediary thermal pathway between the resistance member and the substrate. By creating this intermediate structural feature, heat from the resistance member is efficiently transferred to the substrate through the recessed interface, preventing excessive temperature buildup while enabling high power operation
2Loss of energy
If the resistance member is embedded in the substrate, then heat dissipation is improved, but the contact area for heat dissipation is limited to only the portion touching the substrate
Solution Approach 1:
Instead of relying solely on the two-dimensional contact area between the resistance member and substrate surface, the recessed structure creates a three-dimensional heat dissipation pathway. The resistance member extends into the recess, allowing heat to dissipate through the recessed walls and base, effectively utilizing volumetric heat transfer rather than just surface contact
Solution Approach 2:
The heat dissipation function is segmented into multiple pathways: heat can escape through the recessed structure's base, sides, and through the resistance member's own structure. This segmentation of the heat dissipation route increases the effective heat transfer area beyond what would be available from simple surface contact alone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively lowers the temperature of the resistance member, enabling the chip resistor to handle high power applications by improving heat dissipation and allowing for precise resistance value adjustments.
Implementation Method 1
the contact area between the resistance member and the insulating substrate increases. This makes it possible to effectively release heat generated by the resistance member to the insulating substrate
Data Source
AI summary
An object is to provide a chip resistor capable of coping with high power. A chip resistor of the present disclosure includes insulating substrate, a pair of electrodes, and resistance member. A pair of electrodes are provided at both ends of the upper face of insulating substrate. Resistance member is provided on insulating substrate and connected to the pair of electrodes. Insulating substrate has first region in the center thereof and second regions at both ends of first region. Recess is provided in first region of insulating substrate. Resistance member formed in first region has a meandering shape in a top view. At least a part of resistance member is embedded in recess. Trimming groove is provided in resistance member formed in second region.