Recessed Lid Package Structure for Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing semiconductor package structures and fabrication methods are not entirely satisfactory in terms of heat dissipation and integration efficiency, particularly with the increasing demand for higher memory capacity and complex packaging configurations.
Innovation Solution
A method for forming a package structure that includes an interconnect structure over a carrier substrate, a semiconductor die, and a stacked die package structure with a removable film, where the film is removed to create a recess and a T-shaped lid structure with a protruding portion is formed to enhance heat dissipation, allowing for efficient heat transfer and improved package performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional package structure is used, then the fabrication process is simpler, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The lid structure is segmented into a main body and a protruding portion that extends into the recess. This segmentation allows the lid to provide enhanced heat dissipation through the protruding portion while maintaining structural integrity, resolving the contradiction between heat dissipation efficiency and structural simplicity
Solution Approach 2:
The invention introduces a vertical dimension by creating a recess in the semiconductor die and having the lid's protruding portion extend into this recess. This dimensional change enables improved heat dissipation pathways without significantly increasing the lateral footprint, addressing the heat dissipation requirement while controlling overall package complexity
2Temperature
If the lid structure completely covers the semiconductor die, then the heat dissipation is improved, but the electrical connection reliability deteriorates
Solution Approach 1:
The lid structure implements local quality by having a protruding portion that selectively covers only the recess area while leaving other regions exposed. This localized coverage provides heat dissipation enhancement precisely where needed (in the recess) without compromising the electrical connection reliability in other critical areas
Solution Approach 2:
The recess acts as an intermediary space that allows the lid's protruding portion to interface with the semiconductor die without direct complete coverage. This intermediary structure enables thermal management while preserving electrical connection pathways, resolving the contradiction between heat dissipation and connection reliability
3Productivity
If a complex multi-layer package structure is formed, then the integration efficiency is improved, but the fabrication time increases
Solution Approach 1:
The recess is formed in the semiconductor die before the lid structure is attached. This preliminary action allows subsequent processing steps to be simplified and performed more efficiently, as the recess pre-positioning enables direct lid attachment without requiring additional alignment or adjustment steps, thus improving integration efficiency while controlling fabrication time
Data Source
AI summary
A method for forming a package structure is provided, including forming an interconnect structure over a carrier substrate and forming a semiconductor die over a first side of the interconnect structure. A removable film is formed over the semiconductor die. The method includes forming a first stacked die package structure over the first side of the interconnect structure. A top surface of the removable film is higher than a top surface of the first stacked die package structure. The method includes forming a package layer, removing a portion of the package layer to expose a portion of the removable film, removing the removable film to form a recess, forming a lid structure over the semiconductor die and the first stacked die package structure. The lid structure has a main portion and a protruding portion disposed in the recess and extending from the main portion.