Recessed Semiconductor Layout for Precise Fluid Transfer Alignment
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Solution Overview
Problem
Current mass transfer technologies for semiconductor units result in non-uniform distribution and poor electrical connections due to random positioning during the fluid transfer process, affecting the reliability of semiconductor units.
Innovation Solution
The electronic device incorporates a substrate structure with an insulating layer having recesses, where semiconductor units are disposed in these recesses, and a first electromagnetic signal adjusting unit is positioned on the insulating layer to adjust electromagnetic signals, ensuring precise placement and improved connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid transfer process is used to transfer semiconductor units, then mass production capability is improved, but positioning precision and distribution uniformity deteriorate
Solution Approach 1:
The patent divides the transfer target into multiple recesses (first recess, second recess, etc.) on the substrate. Each recess acts as an independent positioning cavity that receives semiconductor units transferred via fluid transfer. This segmentation allows mass transfer while ensuring each unit is confined to its designated location, thereby maintaining positioning precision despite high-volume transfer.
Solution Approach 2:
The patent introduces an insulating layer as an intermediary structure between the substrate and the semiconductor units. This insulating layer with integrated recesses serves as a mediator that guides and positions the semiconductor units during fluid transfer, enabling both high-speed transfer and precise positioning by providing physical boundaries that the fluid-borne units naturally settle into.
2Productivity
If semiconductor units are transferred through fluid transfer process, then transfer efficiency is improved, but electrical connection quality deteriorates
Solution Approach 1:
The patent prepares the substrate with pre-formed recesses and insulating structures before the fluid transfer process. This preliminary action ensures that when semiconductor units are transferred via fluid, they automatically settle into predetermined positions with proper orientation and contact alignment, thereby ensuring reliable electrical connections are established during the transfer itself rather than requiring subsequent adjustment.
3Ease of manufacture
If semiconductor units are disposed randomly during transfer, then transfer process simplicity is improved, but distribution uniformity deteriorates
Solution Approach 1:
The patent implements local quality by creating distinct recesses at specific locations on the substrate, each designed to receive a semiconductor unit. While the overall transfer process remains simple and random, the local structure of each recess provides deterministic positioning, ensuring uniform distribution across the substrate without complicating the global transfer mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the uniformity of semiconductor unit distribution and electrical connections, improving the reliability and performance of electronic devices by ensuring orderly placement and efficient signal adjustment.
Implementation Method 1
a first electromagnetic signal adjusting unit disposed on the insulating layer and configured for adjusting an electromagnetic signal, wherein the first electromagnetic signal adjusting unit is overlapped with the semiconductor unit
Implementation Method 2
In a top view of the electronic device, a first distance is between a defined center of the recess and a defined center of the semiconductor unit, a second distance is between a defined center of the first electromagnetic signal adjusting unit and the defined center of the semiconductor unit, and the first distance is greater than 0 and the second distance is less than or equal to the first distance
Data Source
AI summary
An electronic device includes a substrate structure, an insulating layer, a semiconductor unit and a first electromagnetic signal adjusting unit. The insulating layer is disposed on the substrate structure and has a recess. The semiconductor unit is disposed in the recess. The first electromagnetic signal adjusting unit is disposed on the insulating layer and configured for adjusting an electromagnetic signal, wherein the first electromagnetic signal adjusting unit is overlapped with the semiconductor unit. In a top view of the electronic device, a first distance is between a defined center of the recess and a defined center of the semiconductor unit, a second distance is between a defined center of the first electromagnetic signal adjusting unit and the defined center of the semiconductor unit, and the first distance is greater than 0 and the second distance is less than or equal to the first distance.