Recessed Sensor Substrate Nesting for Area Reduction
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Solution Overview
Problem
Existing electronic assemblies with surface-mounted sensors and integrated circuits occupy more real estate on substrates than necessary, leading to inefficient use of space and potential damage from environmental factors, as well as increased susceptibility to noise and parasitic capacitances due to the spacing required between components.
Innovation Solution
A substrate with recessed sensing and processing elements, where sensors are embedded within recesses on the backside surface and circuitry is on the frontside, allowing for closer proximity of sensors and reduced interconnection lengths, while also providing protection and optional exposure through apertures, filters, or lenses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If sensors and integrated circuits are surface-mounted on a substrate, then they can be easily assembled and connected, but they occupy excessive substrate area and increase susceptibility to environmental damage and noise
Solution Approach 1:
The patent embeds sensors and integrated circuits within recesses formed in the substrate, nesting components inside the substrate volume rather than mounting them on the surface. This nesting approach reduces the footprint on the substrate surface while providing protective enclosure for the embedded components, simultaneously addressing both area reduction and reliability improvement.
Solution Approach 2:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding by creating recesses that extend into the substrate depth. This dimensional change allows components to be positioned within the substrate volume, reducing surface area occupation while maintaining electrical connectivity through conductors that extend to the component locations.
2Area of stationary object
If sensors are embedded within recesses, then substrate real estate is optimized and sensors are protected, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process is segmented into distinct stages: forming recesses in the substrate, embedding sensors in selected recesses, forming encapsulant material, creating apertures in the encapsulant, and adding protective coatings. This segmentation allows each manufacturing step to be independently optimized and controlled, managing overall process complexity while achieving the embedded sensor configuration.
Solution Approach 2:
The recesses are formed in the substrate before sensor embedding, and the encapsulant material is applied before creating apertures. These preliminary actions prepare the substrate structure in advance, facilitating subsequent sensor placement and protection steps while maintaining manufacturing efficiency.
3Ease of manufacture
If components are spaced further apart on the substrate, then manufacturing and assembly are easier, but interconnection conductors become longer increasing parasitic capacitance
Solution Approach 1:
The patent merges sensors and integrated circuits into a closely spaced embedded configuration within the substrate recesses. This merging eliminates the need for extensive external interconnection conductors, reducing parasitic capacitance while the substrate itself provides the manufacturing and assembly platform, maintaining ease of manufacture.
Data Source
AI summary
Backside recesses in a base member host components, such as sensors or circuits, to allow closer proximity and efficient use of the surface space and internal volume of the base member. Recesses may include covers, caps, filters and lenses, and may be in communication with circuits on the frontside of the base member, or with circuits on an active backside cap. An array of recessed components may a form complete, compact sensor system.