Recessed Insulated Wire Structure for Direct-Contact Motor Cooling

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Solution Overview

Problem

Existing electromagnetic wire cooling methods in drive motors suffer from low heat conduction efficiency due to a small contact area between the cooling tube and the wire, leading to inefficient cooling of the motor.

Innovation Solution

An insulated wire design with a sunken part and convex part on its surface, allowing for a direct contact cooling channel with a larger contact area, enhancing heat conduction efficiency and cooling speed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a cooling tube is introduced between electromagnetic wires to cool the motor, then the cooling function is improved, but the contact area between the cooling tube and electromagnetic wire is small, resulting in low heat conduction efficiency

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcontact area
Core Design Contradiction:
TemperatureVSArea of stationary object

Solution Approach 1:

The patent transitions from a traditional cooling tube approach to a planar cooling structure integrated directly into the wire insulation layer. The sunken part creates a two-dimensional cooling surface that contacts the electromagnetic wire directly, eliminating the need for a three-dimensional cooling tube and significantly increasing the contact area for heat dissipation.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling structure is merged with the insulating layer of the electromagnetic wire itself. The sunken part is formed within the insulating layer, combining the insulation function and cooling function into a single integrated component, thereby maximizing contact area without adding separate cooling tubes.

Inventive Principle:
Principle #5Merging (Combining)

2Temperature

If the depth of the sunken part (L2) is increased to improve cooling effect, then heat dissipation performance improves, but the insulating layer becomes thicker, impeding heat dissipation and reducing productivity

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidwiring efficiency
Core Design Contradiction:
TemperatureVSProductivity

Solution Approach 1:

The patent optimizes the depth parameter L2 of the sunken part to balance cooling performance with manufacturing efficiency. By controlling L2 within a specific range, the design achieves effective heat dissipation while preventing excessive insulating layer thickness that would impede heat transfer and reduce productivity.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves cooling efficiency by increasing the contact area for the cooling medium, resulting in faster and more effective heat dissipation.

Implementation Method 1

a cooling channel can be formed between wires, thus the cooling medium is in direct contact with the insulated wire, thereby improving the heat conduction efficiency

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS12406780B1Insulated wire and preparation method thereof, coil and electronic/electrical device
Publication Date: 2025.09.02 WELL ASCENT ELECTRONIC (GANZHOU) CO LTD
  • US12406780B1 patent drawing
  • US12406780B1 patent drawing
  • US12406780B1 patent drawing

AI summary

An insulated wire and a preparation method thereof, a coil and an electronic/electrical device are provided. The insulated wire includes a conductor and an insulating layer at the periphery of the conductor. The cross section of the conductor is rectangular, a sunken part is formed in the insulating layer on at least one surface of the conductor, the sunken part extends in the whole length direction of the insulating layer, a convex part is formed in the left and right sides of the sunken part, the distance between the bottommost part of the sunken part and the surface of the conductor is L1, L1 is 50 μm-300 μm, the distance between the bottom of the sunken part and the highest point of the convex part is L2, and the value that L1 is divided by the sum of L2 and L1 is greater than 1.3 and smaller than or equal to 10.