Recording Head Subassembly Using Different Wafer Pattern Densities
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Solution Overview
Problem
The increasing complexity and cost of manufacturing read/write heads for hard disk drives due to the need for additional components and advanced technologies, such as HAMR and MAMR, have not been adequately addressed by existing wafer fabrication processes, leading to higher costs per unit area and reduced cost efficiency.
Innovation Solution
A method involving the formation of recording head components on wafers with different pattern densities, followed by transfer printing and assembly to form subassemblies, allowing for reduced wafer output while maintaining or improving factory footprint and capital costs, utilizing techniques like transfer printing and flip-chip bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional components and advanced technologies (HAMR, MAMR) are integrated into read/write head manufacturing, then functionality and performance are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent segments the manufacturing process into two distinct wafer fabrication stages: first wafer for complex components (write head, read head, heater for HAMR/MAMR) at high pattern density, and second wafer for simpler components (interconnects, land pads) at low pattern density. This segmentation allows each wafer to be optimized independently, reducing overall manufacturing complexity while maintaining advanced functionality.
Solution Approach 2:
The patent introduces transfer printing as an intermediary process that bridges the two separately fabricated wafers. This intermediary step enables the combination of components from different fabrication processes, allowing advanced functionalities from the first wafer to be integrated with supporting components from the second wafer without requiring a single complex fabrication line.
2Adaptability or versatility
If additional components and advanced technologies are integrated, then performance is improved, but cost per unit area increases
Solution Approach 1:
By segmenting component fabrication across two wafers with different pattern densities, the patent enables cost optimization. The first wafer uses high pattern density for critical components requiring advanced features, while the second wafer uses low pattern density for less critical components, reducing overall manufacturing cost per unit area while maintaining performance.
Solution Approach 2:
The patent changes the pattern density parameter between the two wafers - high pattern density for complex components on the first wafer and low pattern density for simpler components on the second wafer. This parameter change allows optimization of manufacturing costs while maintaining the required performance characteristics of each component type.
3Productivity
If wafer fabrication processes are advanced to accommodate additional components, then manufacturing capability is improved, but factory footprint and capital cost increase
Solution Approach 1:
The patent segments the manufacturing capability requirements into two separate wafer fabrication lines with different capabilities. This segmentation allows each line to be smaller and less capital-intensive, as they don't need to accommodate all component types, thereby reducing the total factory footprint while maintaining advanced manufacturing capability.
Solution Approach 2:
Transfer printing serves as an intermediary that enables advanced manufacturing capability without requiring a single large, expensive fabrication line. By using transfer printing to combine components from smaller, specialized wafers, the patent achieves advanced manufacturing capability with reduced factory footprint and lower capital costs.
Data Source
AI summary
A first set of components (e.g., recording head components) is formed on a first wafer at a first pattern density. A second set of components is formed on a second wafer at a second pattern density that is less than half that of the first pattern density. The first and second sets of components are joined to form respective subassemblies (e.g., recording head subassemblies).