Rectangular Waveguide Memory Processor Communication
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Solution Overview
Problem
The stacking of DRAM memory devices and processors for high data transfer rates leads to reduced heat dissipation and inflexibility in layout due to the generation of heat and the need for direct electrical connections, which attenuates high-frequency signal transmission.
Innovation Solution
The use of a rectangular waveguide for signal transmission between semiconductor chips, functioning as a high-pass filter, allows for high-speed data transfer without stacking, enhancing heat dissipation and layout flexibility by transmitting signals at frequencies up to 100 GHz or higher with low loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If DRAM memory devices and processors are stacked one on top of the other for direct connection, then data transfer rate is improved, but heat dissipation performance deteriorates and chip temperature increases
Solution Approach 1:
The patent transitions from vertical stacking (3D integration) to planar separation with waveguide connection (2D layout with electromagnetic field transmission). By using rectangular waveguides to transmit signals through space rather than direct physical contact, the system achieves high-speed data transfer without the thermal accumulation problems of stacked configurations, effectively moving the connection dimension from physical contact to electromagnetic field transmission.
2Productivity
If DRAM memory devices and processors are stacked for direct connection, then data transfer rate is improved, but layout flexibility deteriorates
Solution Approach 1:
The patent enables independent planar placement of memory devices and processors by using waveguides for signal transmission. This separates the data transfer function from direct physical contact, allowing components to be positioned flexibly on the substrate without requiring vertical stacking, thus restoring layout flexibility while maintaining high-speed communication capabilities.
3Reliability
If copper wire is used for connection between memory and processor, then electrical connection is achieved, but high-frequency signal transmission deteriorates due to signal attenuation
Solution Approach 1:
The patent replaces the mechanical/electrical connection system (copper wires) with an electromagnetic field-based transmission system (rectangular waveguides). This substitution eliminates the parasitic capacitance and resistance issues inherent in copper wire connections, enabling high-frequency signal transmission up to 100 GHz and beyond without significant attenuation, while still providing reliable signal transmission between components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-speed data transfer between DRAM and processors without stacking, improving heat dissipation and layout flexibility while minimizing noise interference, allowing for efficient data transfer and command signal transmission.
Implementation Method 1
The rectangular waveguide substantially functions as a high-pass filter. Accordingly, it is possible to perform signal transmission using the rectangular waveguide at a high speed by increasing the frequency of a signal to be transmitted or received to, for example, 100 GHz or higher.
Implementation Method 2
The rectangular waveguide substantially functions as a high-pass filter. Accordingly, it is possible to perform signal transmission using the rectangular waveguide at a high speed by increasing the frequency of a signal to be transmitted or received
Data Source
AI summary
Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.