Redistribution Layer Passive Component Integration

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Solution Overview

Problem

Semiconductor devices face challenges in improving performance while reducing dimensions, particularly due to parasitic losses and the physical constraints of discrete passive components, which occupy significant space and interact electromagnetically with semiconductor chips.

Innovation Solution

Incorporating passive components, such as inductors or transformers, into a redistribution layer with planar metallization layers and magnetic materials, and using a metal structure for electromagnetic shielding to reduce electromagnetic interactions and system height.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If passive components are implemented as discrete components, then they provide necessary electrical functions, but they occupy significant area and increase system height

Engineering Contradiction:

Improveparasitic lossesVSAvoidarea consumption

Core Design Contradiction:

Loss of energyVSArea of stationary object

Solution Approach 1:

The patent merges passive components (inductors, transformers) with the redistribution layer structure by forming windings directly in metallization layers of the redistribution layer, eliminating the need for separate discrete passive components and reducing overall area consumption

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from planar windings to three-dimensional windings that extend in the vertical direction through multiple metallization layers, increasing the winding length and inductance value without occupying additional lateral area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Loss of energy

If passive components are implemented as discrete components, then they provide necessary electrical functions, but they increase system height

Engineering Contradiction:

Improveparasitic lossesVSAvoidsystem height

Core Design Contradiction:

Loss of energyVSLength of stationary object

Solution Approach 1:

The patent integrates passive components within the redistribution layer structure, using the same vertical space for both signal redistribution and passive component functionality, thereby minimizing system height

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent nests the passive component windings within the redistribution layer metallization layers, placing functional elements inside the existing structural framework to eliminate additional height

Inventive Principle:

Principle #7Nested doll (Nesting)

3Area of stationary object

If passive components are placed close to the semiconductor chip, then area consumption is reduced, but electromagnetic interactions between chip and passive components increase

Engineering Contradiction:

Improvearea consumptionVSAvoidelectromagnetic interactions

Core Design Contradiction:

Area of stationary objectVSObject-generated harmful factors

Solution Approach 1:

The patent introduces a magnetic shielding layer as an intermediary between the semiconductor chip and passive components, which blocks and redirects magnetic flux to prevent harmful electromagnetic interactions while allowing close integration

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent uses magnetic shielding material that converts harmful magnetic flux into beneficial contained magnetic fields, directing flux through designated paths to improve inductor performance while preventing interference with the chip

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

4Ease of manufacture

If windings are formed in planar metallization layers, then manufacturing is simplified, but inductance value is limited due to area constraints

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidinductance value

Core Design Contradiction:

Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent extends windings from two-dimensional planar traces into the third vertical dimension by routing conductors through multiple metallization layers, significantly increasing winding length and inductance value while maintaining manufacturing compatibility

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the winding structure into multiple segments across different metallization layers, with each layer contributing a portion of the total winding length, allowing cumulative inductance buildup without requiring a single large planar area

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces parasitic losses, minimizes system height, and decreases area consumption by integrating passive components closer to the semiconductor chip, while providing effective electromagnetic shielding to mitigate interactions between the chip and passive components.

Implementation Method 1

using a metal structure for electromagnetic shielding to reduce electromagnetic interactions

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10186481B2Semiconductor device including a passive component formed in a redistribution layer

Publication Date: 2019.01.22 INFINEON TECHNOLOGIES AG

AI summary

A device includes a semiconductor chip, a plurality of planar metallization layers arranged over a main surface of the semiconductor chip, and a passive component including windings, wherein each of the windings is formed in one of the plurality of planar metallization layers.