Substrate-Free LED Package with Redistribution Layer
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Solution Overview
Problem
Conventional light-emitting diode package modules are limited in size reduction, making them unsuitable for lightweight and compact designs due to the presence of a package substrate and wire-bonding structure.
Innovation Solution
A substrate-free light-emitting package structure is developed, featuring a driving device with a redistribution layer structure that includes conductive pads on both surfaces of the drive chip, allowing direct electrical connection between the drive chip and light-emitting chips without a package substrate or bonding wires, and utilizing through-silicon via technology for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a package substrate and wire-bonding structure are used in conventional LED package modules, then electrical connection between chips is established, but the package size cannot be further reduced
Solution Approach 1:
The patent extracts and removes the package substrate from the conventional LED package structure, eliminating the need for wire bonding. The driving chip is directly mounted on the circuit board, and light-emitting chips are directly connected to the driving chip through conductive pads, thereby removing unnecessary structural elements to reduce package size.
Solution Approach 2:
The patent merges the functions of the package substrate and wire bonds into a simplified direct-connection structure. The driving chip integrates multiple functions, and the light-emitting chips are directly electrically connected to the driving chip through conductive pads formed on the circuit board, combining multiple components into a compact integrated structure.
2Weight of moving object
If a package substrate is used to mount all chips, then electrical connection is established, but the design cannot achieve lightweight and compact goals
Solution Approach 1:
The patent extracts the package substrate from the structure, eliminating its weight and bulk. The driving chip is directly mounted on the circuit board, and light-emitting chips are directly connected through conductive pads, removing the heavy substrate component to achieve lightweight design.
Solution Approach 2:
The patent transitions from a planar arrangement on a substrate to a three-dimensional stacked structure where light-emitting chips are positioned above the driving chip and connected through vertical conductive pads, utilizing the vertical dimension to reduce horizontal footprint and achieve compactness.
Data Source
AI summary
A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.