Semiconductor Package Redistribution Layer Surface Roughness

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Solution Overview

Problem

Semiconductor device packages face contamination and performance issues due to manufacturing processes that can damage the working area, affecting the performance of the device, particularly in display modules where optical lighting components are used.

Innovation Solution

A semiconductor device package design featuring a redistribution layer with a side wall surface roughness (Ra) of up to 2 micrometers, which minimizes contamination and ensures proper exposure of the semiconductor device, allowing for improved performance in display modules by reducing surface roughness and ensuring effective light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If manufacturing operations are performed on the semiconductor device, then the device can be assembled and packaged, but the working area may become contaminated or damaged

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidcontamination of working area

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent divides the manufacturing process into distinct stages: first forming the redistribution layer and opening, then subsequently attaching the semiconductor device. This segmentation allows the working area to be protected from contamination during the redistribution layer formation, while still enabling complete device assembly and packaging.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The redistribution layer and its opening are formed in advance before the semiconductor device is attached. This preliminary action ensures that the working area is exposed only when needed, protecting it from contamination during the manufacturing operations that form the redistribution layer structure.

Inventive Principle:

Principle #10Preliminary action

2Object-affected harmful factors

If the side wall surface roughness is reduced to minimize contamination, then the working area is better protected, but the manufacturing process becomes more difficult

Engineering Contradiction:

Improvecontamination reductionVSAvoidmanufacturing difficulty

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent specifies a particular surface roughness range (Ra of 0.1 to 2.0 micrometers) for the side wall of the opening. This local quality control focuses the roughness requirement specifically on the side wall surface that contacts the semiconductor device, rather than requiring smooth surfaces throughout the entire structure, balancing contamination protection with manufacturability.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent defines a specific parameter range for surface roughness (Ra = 0.1 to 2.0 micrometers) that optimizes both contamination protection and manufacturing ease. This parameter specification provides clear manufacturing targets that balance the need for smooth surfaces to prevent contamination with the practical constraints of manufacturing processes.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11373967B2Semiconductor device package and method for packaging the same

Publication Date: 2022.06.28 ADVANCED SEMICON ENG INC

AI summary

A semiconductor device package includes a first semiconductor device; a second semiconductor device; and a first redistribution layer disposed on the first semiconductor device and having a side wall defining an opening that exposes the first semiconductor device. The side wall of the first redistribution layer has an average surface roughness (Ra) in a range up to 2 micrometers (μm).