Redistribution Via Layout for Strain-Resistant Semiconductor Packaging
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Solution Overview
Problem
The semiconductor industry faces challenges in reducing strain and defects in redistribution structures, which affect the flexibility and reliability of semiconductor devices due to the increasing integration density and demand for smaller packaging techniques.
Innovation Solution
The implementation of stacked-via and staggered-via configurations in redistribution structures, which reduce strain and eliminate defects by strategically aligning and overlapping conductive vias to improve circuit design flexibility and routing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional redistribution structures are used to achieve high integration density, then more components can be integrated into a given area, but strain and defects increase affecting reliability
Solution Approach 1:
The redistribution structure is segmented into multiple layers with different via configurations. First redistribution layers use stacked-via configurations while second redistribution layers use staggered-via configurations, allowing each layer to be optimized for its specific function and reducing cumulative strain effects
Solution Approach 2:
The patent transitions from planar redistribution to three-dimensional stacked and staggered via configurations. This vertical dimensionality allows higher integration density while distributing strain across multiple levels, preventing defect accumulation that would occur in traditional two-dimensional layouts
2Quantity of substance
If minimum feature size is reduced to increase integration density, then more components fit in a given area, but manufacturing precision and reliability deteriorate
Solution Approach 1:
The via alignment problem is segmented by dividing the redistribution structure into multiple layers, each with its own via configuration. This allows relaxation of alignment requirements at any single interface while maintaining overall precision through the stacked architecture
Solution Approach 2:
Multiple via layers are nested vertically with overlapping footprints. The staggered-via layers are positioned between stacked-via layers, creating a nested configuration that improves manufacturing tolerance by distributing alignment requirements across multiple interfaces rather than requiring perfect alignment at each interface
3Reliability
If stacked-via and staggered-via configurations are implemented, then strain and defects are reduced improving reliability, but device complexity increases
Solution Approach 1:
The patent merges stacked-via and staggered-via configurations into a unified redistribution structure. By combining these configurations across different redistribution layers, the design achieves strain reduction benefits while sharing common manufacturing processes and materials, thereby managing complexity
Data Source
AI summary
A semiconductor device having a redistribution structure and a method of forming the same are provided. A semiconductor device includes a semiconductor structure, a redistribution structure over and electrically coupled the semiconductor structure, and a connector over and electrically coupled to the redistribution structure. The redistribution structure includes a base via and stacked vias electrically interposed between the base via and the connector. The stacked vias are laterally spaced apart from the base via.