Reduced Height Stacked Die Package via Recessed Bottom Silicon

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Solution Overview

Problem

There is a need to reduce the height of semiconductor packages for mobile electronics to enable the production of thinner devices, as package height is a critical factor in consumer preference and device thickness, particularly in portable electronics like smartphones and wearables.

Innovation Solution

The implementation of reduced height semiconductor packages is achieved through a stacked die package design, where a bottom functional silicon die is thinned by etching a recess and a top component is positioned partially within this recess, maintaining electrical connectivity via micro-bumps and wire bonds or TSVs, allowing for further height reduction without compromising stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If conventional semiconductor package design is used, then structural integrity and electrical functionality are maintained, but package height is too large for thin mobile devices

Engineering Contradiction:

Improvepackage heightVSAvoidstructural integrity

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent embeds the top component within a recess formed in the bottom functional silicon die, creating a nested structure where one component is partially contained within another. This nesting approach reduces the overall package height while maintaining the functional integrity of both components, directly addressing the contradiction between height reduction and structural reliability

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent creates a localized recess in the bottom die rather than thinning the entire die structure. This local modification allows height reduction in the critical area where the top component is positioned, while preserving the overall structural integrity and thickness of the bottom die for mechanical strength and electrical functionality

Inventive Principle:

Principle #3Local quality

2Length of moving object

If the bottom functional silicon die is thinned to reduce height, then package height decreases, but structural strength and stability are compromised

Engineering Contradiction:

Improvevertical heightVSAvoiddie strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The recess is formed only in the specific region where the top component needs to be positioned, rather than thinning the entire bottom die. This localized approach reduces height where necessary while preserving the overall strength and structural integrity of the bottom die for mechanical support and electrical functionality

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The bottom die is thinned partially (only in the recess area) rather than uniformly across the entire die. This partial thinning provides sufficient height reduction to accommodate the top component while maintaining adequate die thickness in other areas to preserve structural strength and stability

Inventive Principle:

Principle #16Partial or excessive action

3Length of moving object

If a recess is etched into the bottom die to position the top component, then package height is reduced, but manufacturing complexity increases

Engineering Contradiction:

Improvepackage heightVSAvoidmanufacturing process complexity

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The patent modifies the geometric parameters of the bottom die by creating a recess with specific depth and dimensions. This parameter change allows the top component to be positioned within the recess, reducing overall package height. The process uses standard semiconductor fabrication techniques (etching, deposition) to achieve the desired geometry without introducing fundamentally new manufacturing steps

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of thinner consumer products by reducing the vertical height of semiconductor packages, enhancing device thinness while maintaining structural integrity and electrical functionality, thus addressing the market demand for slimmer mobile electronics.

Implementation Method 1

a recess formed within the bottom functional silicon die by a thinning etch partially reducing a vertical height of the bottom functional silicon die at the recess

Methodology Applied

Scientific EffectEtching:

Implementation Method 2

maintaining electrical connectivity via micro-bumps and wire bonds or TSVs

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

maintaining electrical connectivity via micro-bumps and wire bonds or TSVs

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics

Publication Date: 2022.10.11 INTEL CORP

AI summary

In accordance with disclosed embodiments, there are provided methods, systems, and apparatuses for implementing reduced height semiconductor packages for mobile electronics. For instance, there is disclosed in accordance with one embodiment a stacked die package having therein a bottom functional silicon die; a recess formed within the bottom functional silicon die by a thinning etch partially reducing a vertical height of the bottom functional silicon die at the recess; and a top component positioned at least partially within the recess formed within the bottom functional silicon die. Other related embodiments are disclosed.