Redundant DSP Block Routing for Defect-Tolerant Signal Stitching

Solution Overview

Problem

Integrated circuits with multiple DSP blocks face challenges in performing complex operations due to potential manufacturing defects, which can render entire circuits unusable, limiting their functionality and yield in manufacturing.

Innovation Solution

Incorporating redundancy in DSP block routing circuitry that allows signals to bypass defective blocks, enabling seamless interconnection and operation between adjacent DSP blocks, thus ensuring functionality even if some blocks are defective.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple DSP blocks are stitched together to perform complex DSP operations, then the computational capability and precision are improved, but the vulnerability to manufacturing defects increases

Engineering Contradiction:
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-configuring alternative routing paths and redundancy mechanisms in the interconnect fabric before manufacturing defects are detected. The system includes multiple possible connection routes between DSP blocks, and selection logic is pre-built to choose valid paths. When a defect is found during testing or operation, the system can reconfigure connections to bypass defective blocks without requiring physical changes, thus maintaining reliability while preserving the ability to perform complex stitched operations.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements dynamics by making the interconnect fabric reconfigurable rather than fixed. The routing structure can dynamically change connections between DSP blocks based on which blocks are functional. This allows the system to adapt its topology to avoid defective blocks while maintaining the ability to stitch together functional blocks for complex operations, resolving the contradiction between reliability and computational capability.

Inventive Principle:
Principle #15Dynamics

2Area of stationary object

If DSP blocks are made smaller to fit within row boundaries, then the layout compatibility and integration are improved, but the individual block functionality is reduced

Engineering Contradiction:
Core Design Contradiction:
Area of stationary objectVSAdaptability or versatility

Solution Approach 1:

The patent applies merging by enabling multiple small DSP blocks to be connected and combined through the reconfigurable interconnect fabric to form larger functional units. Individual blocks remain compact to fit row boundaries, but the system can stitch them together to achieve the functionality of larger blocks. This resolves the contradiction by maintaining small physical size while providing large functional capability through combination.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements universality by designing DSP blocks with multiple interfaces and the interconnect fabric with flexible routing capabilities, allowing the same small block to serve different functions depending on how it is connected to neighboring blocks. A single small block can participate in different stitching configurations to support various DSP operations, making the block versatile despite its small size.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If redundancy routing circuitry is added to bypass defective blocks, then the reliability and manufacturing yield are improved, but the device complexity increases

Engineering Contradiction:
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies partial action by implementing redundancy only in the interconnect routing fabric rather than duplicating entire DSP blocks. The redundancy is partial in that it provides alternative paths without full duplication of functional logic. This reduces the complexity overhead compared to full redundancy while still providing sufficient reliability improvement to bypass defective blocks.

Inventive Principle:
Principle #16Partial or excessive action

Solution Approach 2:

The patent uses the interconnect fabric as an intermediary layer between DSP blocks that provides routing flexibility and defect bypass capability. Rather than adding complexity directly to the DSP blocks themselves, the intermediary interconnect structure absorbs the redundancy requirements, isolating the complexity from the functional blocks while still enabling reliability improvements.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentEP2404234B1Digital signal processing circuitry with redundancy and bidirectional data paths
Publication Date: 2013.05.01
  • EP2404234B1 patent drawingFigure 1
  • EP2404234B1 patent drawingFigure 2
  • EP2404234B1 patent drawingFigure 3

AI summary

Digital signal processing ("DSP") circuit blocks are provided that can more easily work together to perform larger (e.g., more complex and/or more arithmetically precise) DSP operations if desired. These DSP blocks may also include redundancy circuitry that facilitates stitching together multiple such blocks despite an inability to use some block (e.g., because of a circuit defect).