Reflected-Light Receiving Component for Laser Annealing Uniformity
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Solution Overview
Problem
Existing laser annealing apparatuses suffer from uneven irradiation due to reflected laser light affecting the optical-system module, causing thermal stress and positional deviations of optical elements, which leads to unstable crystallization processes.
Innovation Solution
A laser irradiation apparatus with a reflected-light receiving component is introduced between the optical-system module and the shield plate to capture and manage reflected light, preventing it from reaching the optical-system module and ensuring uniform irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a shield plate with a slit is used to block edge parts of laser light, then uniform intensity irradiation is achieved, but reflected light from the shield plate reaches the optical-system module causing thermal stress and positional deviation
Solution Approach 1:
A reflected-light receiving component is introduced as an intermediary element between the shield plate and the optical-system module. This component intercepts the reflected laser light that would otherwise reach the optical-system module, preventing thermal stress and positional deviation while maintaining the uniform irradiation achieved by the shield plate with slit
2Reliability
If the shield plate blocks reflected light, then optical-system module stability is improved, but laser light intensity is reduced
Solution Approach 1:
The reflected-light receiving component selectively extracts only the harmful reflected light from the optical path, allowing the main laser light to pass through to the substrate. This separation ensures that the shield plate's protective function is achieved without unnecessarily reducing the intensity of the useful laser light for crystallization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration stabilizes the crystallization process by preventing thermal stress and positional deviations, ensuring consistent and uniform laser irradiation for semiconductor device manufacturing.
Implementation Method 1
the edge part of the laser light on the cross section orthogonal to an optical axis thereof does not pass through the slit and is blocked by a shield part forming the slit. It is conceivable that the laser light blocked by the shield part is reflected by the shield part.
Implementation Method 2
A laser irradiation apparatus that irradiates an amorphous film formed over a substrate with laser light and thereby performs a laser annealing process
Implementation Method 3
irradiates an amorphous film formed over a silicon substrate or a glass substrate with laser light and thereby crystalizes the amorphous film
Data Source
AI summary
A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).