Reflective Mini-LED Packaging Structure for Lower Light Loss
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Solution Overview
Problem
Existing Mini-LED packaging technologies face high production costs, significant light loss, and poor product stability, particularly in COB technology, which affects the efficiency and reliability of light emitting devices.
Innovation Solution
A light emitting device design featuring a substrate with a conductive layer, a first reflective layer, a light emitting element, a second reflective layer, and an encapsulation layer, where the second reflective layer surrounds the light emitting element and has a controlled outer diameter, and the encapsulation layer is in direct contact with the second reflective layer, optimizing the amount of encapsulating glue used and improving light emission uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If COB packaging technology is used to directly mount LED chips on module substrate, then production integration is improved, but production costs increase and product stability deteriorates
Solution Approach 1:
The patent divides the packaging structure into separate components: individual LED chips are mounted on a substrate and then encapsulated separately with encapsulating glue, rather than molding all chips as one large unit. This segmentation allows for better control of each chip's packaging environment, improving reliability while maintaining production efficiency.
Solution Approach 2:
The patent applies different properties to different parts of the packaging structure. The encapsulating glue is specifically formulated to match the thermal expansion coefficient of the LED chip, creating a localized quality match that reduces stress and improves reliability, while the substrate and other components can have different properties optimized for their specific functions.
2Reliability
If encapsulating glue amount is increased to cover LED chip, then chip protection is improved, but light loss increases due to glue absorption
Solution Approach 1:
The patent optimizes the physical and chemical parameters of the encapsulating glue, specifically matching its thermal expansion coefficient to that of the LED chip. This parameter matching reduces internal stress and allows for thinner, more efficient glue layers that protect the chip without excessive light absorption, thereby reducing light loss while maintaining protection.
3Loss of energy
If reflective layer structure is optimized to reduce light loss, then light emission efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts the reflective function from a complex multi-layer structure and implements it through a simplified design where the substrate itself serves as the reflective base, with the encapsulating glue forming a controlled reflection chamber. This extraction of the essential reflective function reduces manufacturing complexity while maintaining or improving light emission efficiency through better light trapping geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces production costs, enhances light emission uniformity, and improves the reliability and market competitiveness of light emitting devices by controlling the amount of encapsulating glue and optimizing the geometric relationship between the reflective and encapsulation layers.
Implementation Method 1
a first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element
Data Source
AI summary
A light emitting device includes a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element. The second reflective layer has an outer diameter. A top surface of the second reflective layer is lower than a top surface of the light emitting element. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer. The encapsulating layer is directly contact with the outer diameter.