Reflective Surface Semiconductor Device Positioning
Solution Overview
Problem
Conventional semiconductor device positioning techniques rely on alignment marks, which can be inaccurate and time-consuming, especially when achieving high precision in the connection between semiconductor chips and mount substrates.
Innovation Solution
A semiconductor device and positioning apparatus that utilize a reflective surface to project images of connection terminals onto a common imaging device, allowing for precise alignment and connection by reflecting light in the thickness direction of the substrate, enabling fast and accurate positioning using a single imaging device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional alignment mark positioning is used, then positioning can be performed between semiconductor chip and substrate, but positioning accuracy is insufficient and positioning time is excessive
Solution Approach 1:
The invention uses optical imaging to create a projected image of the connection terminal on the reflective surface, replacing the need for physical alignment marks. The imaging device captures the reflected light from the connection terminal, creating a visual copy that can be precisely measured and positioned, thereby improving both accuracy and speed
Solution Approach 2:
The invention replaces the conventional mechanical/optical alignment mark system with an optical reflection-based imaging system. By using a reflective surface to project the connection terminal image and an imaging device to capture it, the system eliminates the need for separate alignment marks and enables faster, more accurate positioning
2Measurement precision
If multiple alignment devices are used to achieve high precision positioning, then positioning accuracy improves, but device complexity and cost increase
Solution Approach 1:
The invention combines the positioning function and imaging function into a single integrated system. The reflective surface serves both as a positioning reference and an imaging medium, while the imaging device simultaneously captures both the connection terminal image and alignment information, eliminating the need for separate alignment devices
Solution Approach 2:
The reflective surface serves multiple functions: it acts as a positioning reference, an imaging medium, and a light redirecting element. The imaging device also performs multiple functions by capturing both the connection terminal image and alignment information in a single operation, reducing the need for specialized equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for highly accurate and efficient positioning of semiconductor chips and substrates, reducing the need for multiple alignment devices and improving the speed and precision of the connection process.
Implementation Method 1
a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip
Data Source
AI summary
A semiconductor device includes: a semiconductor chip that has a first connection terminal for wiring connection; a substrate that has a second connection terminal for wiring connection, the second connection terminal being electrically connected to the first connection terminal; and a reflective surface that reflects light from the first connection terminal and the second connection terminal in a thickness direction of the substrate or the semiconductor chip.