Reflector Cooling Chamber for Fast SiC Substrate Heating
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Solution Overview
Problem
Conventional heating assemblies for semiconductor processing chambers are inadequate for rapidly heating silicon carbide (SiC) substrates due to low temperature ramping rates and insufficient cooling capacity, leading to potential damage and limited throughput.
Innovation Solution
A reflector apparatus with a base featuring reflector pockets and cooling chambers that accommodate high-powered radiation lamps, allowing for rapid temperature ramping and efficient cooling through a heat transferring fluid circulation system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high powered heating lamps are used to increase heating rate, then temperature ramping rate improves, but the heating assembly components may be damaged due to excessive heat
Solution Approach 1:
The heating assembly is divided into separate functional zones: a heating zone with high powered lamps for rapid temperature increase, and a cooling zone with cooling channels for heat dissipation. This segmentation allows the system to achieve high heating rates while preventing component damage through localized cooling.
Solution Approach 2:
A reflector apparatus with cooling channels acts as an intermediary between the heating lamps and the heating assembly components. The cooling channels serve as a heat transfer medium that removes excess heat from the reflector and surrounding components, enabling high powered heating operation without damage.
2Productivity
If conventional heating assemblies are used, then device complexity is low, but throughput is limited due to low temperature ramping rate
Solution Approach 1:
The reflector apparatus combines multiple functions into a single integrated component: it reflects radiation from heating lamps to enhance heating efficiency, provides structural support for the heating assembly, and incorporates cooling channels to dissipate heat. This merging of functions increases throughput while managing complexity through functional integration.
Solution Approach 2:
The reflector apparatus serves multiple purposes simultaneously: it acts as a radiation reflector to improve heating efficiency, a structural support element for mounting heating lamps, and a cooling system component through integrated cooling channels. This multi-functionality enables high throughput without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid heating of SiC substrates up to 1800°C at rates exceeding 40°C/second while maintaining the integrity of the heating assembly components, enhancing throughput and preventing damage.
Implementation Method 1
high powered radiation lamps... enabling rapid heating of SiC substrates
Implementation Method 2
cooling capacity and efficiency to cool high powered heating elements... heat transferring fluid circulation system
Data Source
AI summary
Disclosed herein are a reflector apparatus for a heating assembly, and a method for operating the heating assembly. The reflector apparatus includes a base that has a first side having openings for radiation to pass through, a second side opposite to the first side, and a side wall extending between the first side and the second side. The reflector apparatus further includes a first reflector pocket disposed between the first side and the second side of the base and having a first reflector portion. The first reflector portion may include a wavy section having a Fresnel shape. A first reflector cooling chamber encases the first reflector portion and the wavy section. The method includes operating a heating lamp disposed in a reflector pocket at a power of at least 600 W and circulating a coolant within a reflector cooling chamber to cool the heating lamp.