A reflective plate, cooling plate, and gas gap limit heat transfer, coolant boiling, and chuck contamination during substrate treatment.
Integrated reflector pockets and coolant chambers let high-power lamps heat SiC substrates quickly while protecting heating assembly components.
A magnetic material layer on the cooling and base plates shields LED control noise, limiting electromagnetic interference beyond the chuck.
Angled reflective troughs in circular lamp arrays deliver uniform thermal radiation to resolve substrate temperature non-uniformities.
Segmenting cooling air into three independent feeds controls mouth area temperature during infrared heating, preventing preform unusability from overheating.
Segmented luminescent layers distribute energy uniformly across the surface, eliminating decay from edge sources.
Independent zone control compensates for heat loss variations, resolving non-uniform etch rates across semiconductor substrates.
Integrating a movable wall with microwave heating creates a compact sterile zone that prevents contamination during plastic preform processing.
A segmented melting heater uses independent pair heaters to selectively melt joining end surfaces of semi-molded products.
Shield portions on a counter reflector block unwanted irradiation, reducing energy losses and improving heat profile control.