Substrate Support Unit With Reflective Cooling Isolation
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Solution Overview
Problem
Existing substrate treating apparatuses face issues such as heat transfer to spin driving units, boiling of cooling fluids, inflow of treatment liquids or impurities into the chuck, and excessive temperature increase in power supply terminals, which affect the efficiency and reliability of substrate treatment processes.
Innovation Solution
The apparatus incorporates a support unit with a heating member, reflective plate, cooling plate, and gas supply lines to minimize heat transfer and impurity inflow, featuring a cooling plate design with varying contact and spaced portions, and gas supply lines to maintain thermal isolation and prevent contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a lamp heats a substrate to improve substrate treatment efficiency, then substrate treatment efficiency increases, but heat is transferred to the spin driving unit causing temperature increase and potential failure
Solution Approach 1:
A reflective plate is introduced as an intermediary component between the heating lamp and the spin driving unit. The reflective plate reflects thermal radiation away from the spin driving unit while allowing it to reach the substrate, thus mediating the heat transfer path to protect the spin driving unit from overheating while maintaining heating effectiveness for substrate treatment
Solution Approach 2:
The heating and cooling functions are segmented into separate zones. The heating lamp and reflective plate are positioned to create a focused heating zone for the substrate, while a cooling plate with cooling flow paths is positioned in the spin driving unit area to actively cool that zone, separating the thermal management of different components
2Temperature
If a cooling plate with cooling flow path is used to cool the spin driving unit, then spin driving unit temperature is controlled, but boiling phenomenon occurs in the cooling fluid
Solution Approach 1:
The cooling plate features varying contact portions and spaced portions relative to the reflective plate, creating different thermal interaction zones. The contact portions allow heat transfer from the reflective plate, while the spaced portions prevent direct contact and reduce heat transfer to the cooling fluid, locally controlling thermal exposure to prevent boiling
Solution Approach 2:
The cooling plate is designed with partial contact to the reflective plate rather than full contact. This partial contact provides sufficient cooling to the spin driving unit while avoiding excessive heat transfer that would cause the cooling fluid to boil, achieving optimal cooling without overheating the cooling medium
3Loss of energy
If gas is supplied to the space between reflective plate and cooling plate to minimize heat transfer, then heat transfer to spin driving unit is reduced, but device complexity increases
Solution Approach 1:
Gas is supplied to the space between the reflective plate and cooling plate to create a thermal insulation layer. This pneumatic approach reduces heat transfer from the heated reflective plate to the cooling plate and spin driving unit, utilizing gas as a thermal barrier to minimize energy loss to unwanted components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently processes substrates while minimizing heat transfer to spin driving units, preventing boiling of cooling fluids, and reducing impurity introduction, thereby enhancing the reliability and efficiency of substrate treatment.
Implementation Method 1
a heating member configured to transmit thermal energy to a supported substrate
Implementation Method 2
a reflective plate disposed under the heating member and configured to reflect thermal energy generated by the heating member to the substrate
Implementation Method 3
a cooling plate disposed under the reflective plate and formed with a cooling flow path in which a cooling fluid flows
Data Source
AI summary
Provided is a support unit for supporting a substrate, the support unit including: a heating member configured to transmit thermal energy to a supported substrate; a reflective plate disposed under the heating member and configured to reflect thermal energy generated by the heating member to the substrate; a cooling plate disposed under the reflective plate and formed with a cooling flow path in which a cooling fluid flows; and a gas supply line configured to supply gas to a space between the reflective plate and the cooling plate.