Process Chamber Reflector With Segmented Cooling Channels
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Solution Overview
Problem
High-temperature cleaning processes in semiconductor process chambers can damage components due to uneven temperature distribution and high maximum temperatures, necessitating improved cleaning methods and equipment that maintain component integrity while achieving higher cleanliness and faster cleaning times.
Innovation Solution
The introduction of a reflector with a cooling channel system that allows coolant flow, ensuring uniform temperature distribution and reducing maximum temperatures during high-temperature processes, thereby preventing component damage and enhancing cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If higher temperatures are used during cleaning procedures, then cleaning effectiveness and speed are improved, but components in the chamber are damaged due to high temperatures
Solution Approach 1:
The bottom plate is divided into multiple sectors with independent cooling channels in each sector, allowing localized temperature control across different regions of the reflector during high-temperature cleaning processes
Solution Approach 2:
Different sectors of the bottom plate can have different cooling intensities applied to them, enabling each region to maintain optimal temperature characteristics for its specific functional requirements during cleaning operations
2Manufacturing precision
If higher temperatures are used during cleaning procedures, then level of cleanliness is improved, but components in the chamber are damaged due to high temperatures
Solution Approach 1:
The bottom plate is divided into multiple sectors with independent cooling channels in each sector, allowing localized temperature control across different regions of the reflector during high-temperature cleaning processes
Solution Approach 2:
Different sectors of the bottom plate can have different cooling intensities applied to them, enabling each region to maintain optimal temperature characteristics for its specific functional requirements during cleaning operations
3Reliability
If cooling channels are added to the reflector, then temperature control and component protection are improved, but device complexity increases
Solution Approach 1:
The cooling channels are integrated directly into the bottom plate structure itself, combining the cooling function with the existing structural component rather than adding separate cooling apparatus
Solution Approach 2:
The bottom plate serves multiple functions: it provides structural support for the reflector while simultaneously acting as a cooling device with integrated channels that can be controlled independently across different sectors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling channel system enables higher internal temperatures during cleaning, resulting in improved cleanliness and faster process completion without damaging the reflector components, thus addressing the challenge of maintaining component integrity and efficiency.
Implementation Method 1
The cooling channel system enables higher internal temperatures during cleaning, resulting in improved cleanliness and faster process completion without damaging the reflector components
Data Source
AI summary
A reflector for use in a semiconductor process chamber is provided including: a body; and a bottom plate connected to a lower portion of the body, the bottom plate having a bottom surface, a top surface, and one or more side surfaces connecting the bottom surface with the top surface. A cross section of the bottom plate that extends to opposing locations on the one or more side surfaces includes a center, the cross section is divided into two or more sectors that extend from the center of the cross section, and the cross section includes a cooling channel comprising an inlet and one or more outlets.


