Reflector Trough Beam Shaping for Narrow Infrared Emission
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Solution Overview
Problem
Conventional surface-mountable semiconductor components for generating infrared radiation emit a large fraction of their radiation over a wide solid angle range, which is often not usable and can cause disturbances due to scattered light, limiting their application.
Innovation Solution
The optoelectronic semiconductor component features a lead frame with a reflector trough having a circumferential surface subdivided into sub-regions and a potting body that is radiation-transmissive and beam-shaping, allowing for a spatially narrow emission pattern by focusing the radiation into a smaller angular range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional surface-mountable semiconductor components are used, then the component structure is simple and easy to manufacture, but the radiation is emitted over a wide solid angle range causing scattered light and reducing application efficiency
Solution Approach 1:
The reflector trough employs a curved circumferential surface with specifically designed sub-regions that redirect radiation from the semiconductor chip into a concentrated beam. The curvature and angular configuration of the reflector surfaces focus the emitted radiation, transforming the wide-angle emission pattern into a narrow, directed beam that improves application efficiency while maintaining compatibility with standard surface-mountable component manufacturing processes
2Productivity
If a reflector trough with subdivided circumferential surface is implemented, then the radiation emission is focused into a narrow angular range, but the device complexity increases
Solution Approach 1:
The circumferential surface of the reflector trough is segmented into multiple sub-regions, each with specific angular orientations designed to redirect radiation from different portions of the semiconductor chip. This segmentation allows precise control over the radiation beam direction and concentration, achieving narrow angular emission while the overall structure remains integrated with the lead frame and manufacturable using standard processes
3Productivity
If the first sub-region projects beyond the semiconductor chip, then the radiation focusing is improved, but the component height increases
Solution Approach 1:
The reflector trough's circumferential surface features localized projections in the first sub-region that extend beyond the semiconductor chip boundaries. These localized geometric modifications are strategically positioned to optimize radiation reflection and focusing without requiring a uniform increase in overall component height. The projection is confined to specific areas where it provides maximum optical benefit while minimizing impact on component profile
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a significant portion of the radiation emission within a small angular range, reducing unwanted scattering and enhancing the component's application efficiency by concentrating the radiation into a focused beam.
Implementation Method 1
the reflector trough comprises a circumferential surface... The sub-regions of the circumferential surface succeed one another... The first sub-region, which lies closest to the base surface, is oriented perpendicular or substantially perpendicular to the base surface
Implementation Method 2
The potting body is transmissive for the radiation generated in the optoelectronic semiconductor chip... The potting body is configured for beam shaping of the radiation generated and emitted by the optoelectronic semiconductor chip
Data Source
AI summary
An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface.