Reflowable Etch Mask for Semiconductor Patterning
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Solution Overview
Problem
Conventional semiconductor device fabrication methods require multiple photolithography steps and photomasks to form different photoresist patterns, leading to a complex and inefficient process.
Innovation Solution
A method involving the formation of a reflowable etch mask on a substrate, where the etch target film is patterned using the first reflowable etch mask, and the mask is then reflowed to form a second etch mask, allowing for the patterning of multiple films with reduced photolithography processes and photomasks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple photolithography steps and photomasks are used to form different photoresist patterns, then the patterning precision is improved, but the device complexity and manufacturing time increase
Solution Approach 1:
The patent combines multiple photolithography processes into a single integrated process. A reflowable etch mask is formed once, then reflowed multiple times to create different photoresist patterns for patterning multiple etch target films sequentially, eliminating the need for separate photolithography steps and photomasks for each film
Solution Approach 2:
The reflowable etch mask serves multiple functions: it acts as a pattern definition layer, a protective mask during etching, and through reflowing, it creates different photoresist patterns for different etch target films. This single mask structure replaces multiple specialized masks, achieving multi-functionality
2Manufacturing precision
If multiple photolithography steps are performed to pattern multiple etch target films, then the manufacturing precision is improved, but the productivity decreases
Solution Approach 1:
The reflowable etch mask is formed in advance with a preliminary pattern, then through controlled reflowing, it automatically generates the required photoresist patterns for multiple etch target films. This preliminary formation eliminates the need for repeated photolithography steps, significantly improving fabrication efficiency
3Manufacturing precision
If multiple photomasks are used for patterning different films, then the patterning precision is improved, but the loss of substance and increased cost occur
Solution Approach 1:
The reflowable etch mask is reused multiple times through reflowing to create different patterns, maximizing its utility. After completing its function of patterning multiple etch target films, the mask is then removed in a single stripping step, reducing material waste compared to multiple disposable photomasks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the semiconductor device fabrication process by reducing the number of photolithography steps and photomasks needed, while enabling the formation of multiple photoresist patterns efficiently.
Implementation Method 1
The reflow may be performed by a thermal treatment of the first photoresist pattern
Data Source
AI summary
A method of fabricating a semiconductor device is provided. The method includes forming at least one etch target film on a substrate, forming a first reflowable etch mask on the at least one etch target film, patterning the etch target film using the first reflowable etch mask. The method further includes reflowing the first reflowable etch mask to form a second etch mask and patterning the etch target film using the second etch mask.