Reinforced Mother Substrate Cutting for Thinner Display Panels
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Solution Overview
Problem
The thickness of display apparatuses is increased due to the need for a cover window and adhesive layer, which raises production costs and reduces process efficiency.
Innovation Solution
A method involving reinforcing a mother substrate with concave portions, cutting it in units of cells, and using it in the display apparatus without a separate cover window, thereby improving process efficiency and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cover window and adhesive layer are added to protect the display apparatus, then the protective function is improved, but the thickness of the display apparatus increases
Solution Approach 1:
The patent combines the protective functions of the cover window and adhesive layer into the encapsulation substrate itself. The encapsulation substrate is designed with a specific structure including a body portion and a peripheral portion that integrates both protection and adhesion functions, eliminating the need for separate cover window and adhesive layer components.
Solution Approach 2:
The patent extracts and eliminates the separate cover window and adhesive layer from the display apparatus structure. By removing these redundant components and integrating their functions into the encapsulation substrate, the overall thickness is reduced while maintaining protective functionality.
2Reliability
If a cover window and adhesive layer are added to protect the display apparatus, then the protective function is improved, but production costs are raised
Solution Approach 1:
The patent merges multiple components (cover window, adhesive layer, and encapsulation substrate) into a single integrated encapsulation substrate structure. This reduces the number of manufacturing steps, material costs, and assembly operations, thereby lowering production costs while maintaining protective functionality.
Solution Approach 2:
By extracting and removing the separate cover window and adhesive layer components, the patent reduces material costs and simplifies the manufacturing process, leading to lower production costs while the encapsulation substrate provides the necessary protective function.
3Productivity
If the mother substrate is reinforced before cutting, then the cutting process efficiency is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent applies reinforcement to the mother substrate before the cutting process. This preliminary reinforcement prevents substrate breakage during cutting, improves cutting efficiency, and ensures accurate cell separation. The reinforcement is removed after cutting, leaving no residual impact on the final product.
Solution Approach 2:
The reinforcement material is temporarily applied to the mother substrate for the cutting process and then discarded after cutting is complete. This temporary reinforcement enables efficient cutting without permanently increasing the complexity of the manufacturing process or the final product structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances process efficiency and reduces the thickness of display apparatuses by eliminating the need for a cover window and adhesive layer, improving touch sensitivity and reducing production costs.
Implementation Method 1
the reinforcing of the mother substrate may include a first reinforcement using sodium nitrate (NaNO3) and potassium nitrate (KNO3) and a second reinforcement using potassium nitrate (KNO3)
Data Source
AI summary
A method of manufacturing a display apparatus includes: preparing a mother substrate; forming a concave portion, which comprises a first concave portion defined on a first surface of the mother substrate and a second concave portion defined on a second surface opposite to the first surface; reinforcing the mother substrate; and cutting the mother substrate in a lengthwise direction of the concave portion. A reinforcement thickness, which is a thickness of a reinforced part of a non-concave portion of the mother substrate from the first surface, is greater than half a value obtained by subtracting a depth of the first concave portion and a depth of the second concave portion, from a thickness of the non-concave portion of the mother substrate.


