Relay Mounted to Substrate Opening for Low Profile
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronic devices with relays mounted on the top surface of circuit boards face challenges in achieving a low profile, as the height of the relays contributes to the overall profile of the device, limiting their use in applications requiring compact designs.
Innovation Solution
The relay is mounted to the substrate with at least a portion positioned above the top surface and another portion below, allowing it to be recessed within the substrate's thickness, thereby reducing the overall height of the electronic device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the relay is mounted on the top surface of the circuit board, then the relay can be electrically connected to the control circuit, but the height of the relay increases the overall profile of the electronic device
Solution Approach 1:
The relay is repositioned from a surface-mounted configuration to a through-hole mounting configuration, where it passes through the circuit board substrate. This dimensional change allows the relay to be embedded within the board thickness rather than protruding from the surface, effectively reducing the overall profile height while maintaining electrical connectivity through the substrate's conductive pathways.
Solution Approach 2:
The relay is nested within the circuit board substrate by mounting it in a through-hole opening. The relay body is positioned within the thickness of the substrate, with portions extending above and below the top surface, creating a nested arrangement that integrates the relay into the board structure rather than having it protrude externally.
2Length of stationary object
If the relay is recessed within the substrate thickness, then the profile height is reduced, but the relay must be positioned with portions above and below the top surface
Solution Approach 1:
The relay mounting is segmented into multiple positional zones relative to the circuit board: portions extending above the top surface, portions within the substrate thickness, and portions extending below the bottom surface. This segmentation allows the relay to be distributed across different spatial zones, achieving profile reduction while maintaining functional connectivity through strategic positioning in each zone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the profile of the electronic device by integrating the relay within the substrate's thickness, minimizing the protruding height and enhancing the device's compactness without increasing the overall height.
Implementation Method 1
Relays embody a magnetic coil with a switching contact where the coil may be energized by a lower power circuit from the electronic control
Data Source
AI summary
An electronic device includes a substrate having a top surface, a bottom surface and at least one opening therethrough. The substrate has circuitry. A relay is mounted to the substrate and is electrically connected to the circuitry. The relay has a switching device configured to activate the relay. The switching device has contacts electrically connected to the circuitry. The relay is mounted to the substrate in the opening such that at least a portion of the switching device is positioned above the top surface and at least a portion of the switching device is positioned below the top surface.