Semiconductor Relay Wiring Exposure Alignment for Chip Deviations
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Solution Overview
Problem
Existing semiconductor manufacturing processes face challenges in dealing with positional deviations of semiconductor chips on a wafer during wafer-level packaging, which affect the accuracy of exposure processes.
Innovation Solution
An exposure apparatus and method that includes a substrate stage, exposure unit, pattern determination unit, and controller to measure and correct positional deviations of semiconductor chips, allowing for precise exposure of relay wiring patterns onto a photosensitive layer by moving the substrate along a uniaxial direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafer-level packaging is performed with semiconductor chips arranged on a substrate, then productivity is improved through batch processing, but manufacturing precision deteriorates due to positional deviations of semiconductor chips
Solution Approach 1:
The patent applies preliminary action by measuring the positions of semiconductor chips and determining the exposure pattern before the actual exposure process. The controller calculates the exposure pattern based on measured chip positions and substrate deformation, then adjusts the exposure accordingly. This pre-measurement and pre-calculation approach allows the system to compensate for positional deviations before exposure, maintaining manufacturing precision while enabling batch processing of multiple chips.
2Manufacturing precision
If exposure pattern is determined based on measured chip positions, then manufacturing precision is improved, but device complexity increases due to additional measurement and calculation systems
Solution Approach 1:
The patent applies universality by designing a controller that performs multiple functions: it controls the substrate stage, operates the exposure unit, measures chip positions, calculates exposure patterns, and adjusts exposure parameters. By consolidating these diverse functions into a single multi-functional controller, the system achieves high manufacturing precision without proportionally increasing device complexity. The measurement unit and controller work together as an integrated system that handles both measurement and correction tasks.
3Area of stationary object
If substrate is moved during exposure process, then exposure area coverage is improved, but measurement precision deteriorates due to motion during measurement
Solution Approach 1:
The patent resolves this contradiction by performing the measurement action before the exposure action. The measurement unit measures the positions of semiconductor chips and substrate deformation while the substrate is stationary. Only after measurements are complete does the controller calculate the exposure pattern and move the substrate to the exposure unit. This sequencing ensures measurement precision is not compromised by motion, while the subsequent substrate movement enables comprehensive exposure area coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures accurate alignment and exposure of relay wiring patterns, enhancing the manufacturing process by addressing positional deviations and improving the quality of semiconductor devices.
Implementation Method 1
an exposure unit configured to radiate an exposure light toward the draw-out electrode provided in an electrode formation area
Data Source
AI summary
An exposure apparatus includes: a substrate stage onto which a substrate is to be mounted; an exposure unit radiating an exposure light toward the draw-out electrode on at least one semiconductor chip; a pattern determination unit determining an exposure pattern; and a controller controlling the substrate stage and the exposure unit. The pattern determination unit determines a pattern of a relay wiring connecting the draw-out electrode and a predetermined position with respect to the substrate, by using an output from a measurement unit to measure a position of the semiconductor chips on the substrate to obtain a positional deviation. The controller exposes the relay wiring pattern onto an exposure area extending, on the photosensitive layer, in the uniaxial direction by the exposure unit, while moving the substrate from a first-side in the uniaxial direction to a second-side opposite to the first-side in the uniaxial direction by the substrate stage.