Released Micromachined Thermistor for Stress-Stable MEMS Sensing

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Solution Overview

Problem

Existing thermistors face challenges in providing accurate and reliable temperature measurements due to stress-resistance dependence and limited long-term stability, especially when integrated with micro-electromechanical systems (MEMS) devices.

Innovation Solution

The development of micromachined thermistors fabricated from temperature-sensitive crystalline materials like doped silicon or metals, with specific doping levels and shapes such as loop-shapes and serpentine structures, which are partially or entirely released from the substrate to minimize stress effects and enhance sensitivity and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thermistors are integrated with MEMS devices, then system functionality is enhanced, but stress-resistance dependence increases

Engineering Contradiction:
Improvesystem functionalityVSAvoidstress-resistance dependence
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The thermistor is segmented from the substrate through partial or complete release, creating a suspended structure that isolates the sensing element from substrate-induced stresses while maintaining system integration benefits

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The thermistor structure is extracted from the substrate by releasing it through etch holes, removing the source of stress interference while preserving the integrated functionality of the MEMS system

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If thermistors are made fully suspended, then stress effects are minimized, but manufacturing complexity increases

Engineering Contradiction:
Improvestress effects minimizationVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Instead of complete suspension, the patent applies partial release through etch holes, achieving sufficient stress isolation with reduced manufacturing complexity compared to full suspension structures

Inventive Principle:
Principle #16Partial or excessive action

Solution Approach 2:

The release structure is implemented locally through specific etch holes positioned beneath the thermistor, providing stress relief only where needed rather than requiring complete structural reconfiguration

Inventive Principle:
Principle #3Local quality

3Measurement precision

If doping levels are increased, then temperature sensitivity is enhanced, but sensitivity to doping variations increases

Engineering Contradiction:
Improvetemperature sensitivityVSAvoidsensitivity to doping variations
Core Design Contradiction:
Measurement precisionVSManufacturing precision

Solution Approach 1:

The patent optimizes doping levels to achieve an optimal balance point where temperature sensitivity is sufficiently enhanced while remaining tolerant to manufacturing variations in doping concentration

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

These thermistors offer improved accuracy and reliability in temperature measurement by reducing stress-induced errors and maintaining stability over time, even in harsh environmental conditions, while also providing low noise and high accuracy sensing.

Implementation Method 1

a micromachined thermistor structure (12) which is fabricated from a temperature-sensitive crystalline material

Methodology Applied
Scientific EffectTemperature-dependent resistance: Thermistor

Data Source

PatentUS11543301B1Micromachined thermistor
Publication Date: 2023.01.03 SITIME CORP
  • US11543301B1 patent drawing
  • US11543301B1 patent drawing
  • US11543301B1 patent drawing

AI summary

A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.