Remote Phosphor Carrier Heat Dissipation in LED Lamps
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Solution Overview
Problem
Conventional LED packages face heat dissipation issues due to the proximity of phosphor material to the LED chip, leading to elevated operating temperatures, degradation, and reduced conversion efficiency, especially in high-power applications where phosphor conversion heating is significant.
Innovation Solution
The implementation of a remote phosphor configuration with a thermally conductive phosphor carrier that is at least partially transparent to light, coupled with a heat sink structure to efficiently dissipate conversion-generated heat away from the phosphor material, thereby maintaining lower operating temperatures and improving reliability and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If phosphor material is placed close to the LED chip for efficient light conversion, then light conversion efficiency is improved, but operating temperature increases and heat dissipation becomes difficult
Solution Approach 1:
The patent divides the phosphor application into two separate locations: (1) phosphor directly on the LED chip for efficient light conversion, and (2) remote phosphor in a phosphor carrier positioned away from the heat source. This segmentation allows each phosphor location to serve different functions while managing heat distribution.
Solution Approach 2:
The patent transitions from a single-plane phosphor configuration to a three-dimensional arrangement by positioning the phosphor carrier in space away from the LED chip. This spatial separation allows light to travel through a medium (encapsulant or air gap) while phosphor conversion occurs at a distance from the heat source, solving the heat dissipation problem.
2Productivity
If phosphor material is placed close to the LED chip, then light conversion efficiency is improved, but phosphor degradation and color shifting occur due to heat
Solution Approach 1:
The patent segments phosphor functionality into two locations: phosphor on the LED chip for efficient conversion and remote phosphor in a carrier for heat avoidance. This allows the system to maintain high conversion efficiency while protecting phosphor material from thermal degradation.
Solution Approach 2:
The patent introduces an intermediate medium (encapsulant material or air gap) between the LED chip and the phosphor carrier. This intermediary allows light energy to transfer from the LED to the remote phosphor while providing thermal isolation, protecting the phosphor from direct heat exposure that causes degradation and color shifting.
3Device complexity
If conventional LED package structure is used, then device simplicity is maintained, but heat dissipation is insufficient for high-power applications
Solution Approach 1:
The patent segments the heat dissipation function from the light conversion function by placing the phosphor carrier separately from the LED chip mounting location. This allows heat to be managed independently through the substrate and PCB while light conversion occurs in the phosphor carrier, improving overall heat dissipation efficiency.
Solution Approach 2:
The patent moves phosphor conversion to a different spatial dimension away from the heat-generating LED chip, allowing heat to dissipate through the substrate and PCB in the vertical dimension while light conversion occurs in the horizontal plane, thereby improving heat management without complicating the basic package structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces heat-related degradation and color shifting, enhances the long-term reliability of the phosphor material, and allows for more efficient light conversion while maintaining a consistent color emission, even under high current conditions.
Implementation Method 1
a conversion material that absorbs light from the light source and emits a different wavelength of light
Implementation Method 2
A first thermally conductive path is included to conduct conversion heat away from the conversion material to the heat sink
Implementation Method 3
a heat sink structure thermally coupled to the phosphor carrier
Data Source
AI summary
LED lamps or bulbs are disclosed that comprise a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink. The phosphor carrier can have a three-dimensional shape and comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light passes through the phosphor carrier. The phosphor carrier converts at least some of the LED light, with some embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can operate at a lower temperature to have greater phosphor conversion efficiency and reduced heat related damage. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and conceal the phosphor carrier.