Remote Conductive Reservoir Interconnects for Flexible Die Assembly
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Solution Overview
Problem
Conventional semiconductor device packaging methods face challenges in efficiently connecting multiple dies due to design constraints imposed by the need for conductive materials to align precisely with narrow openings, limiting the implementation of interconnects and restricting design flexibility.
Innovation Solution
The use of remote reservoirs of conductive material adjacent to and remote from openings, which expand thermally to form interconnects, allowing for more flexible placement and wider variety of designs without the need for precise alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conductive materials are precisely aligned with narrow openings in conventional packaging, then manufacturing precision is improved, but design flexibility deteriorates
Solution Approach 1:
The conductive material is divided into two separate components: a reservoir portion and an interconnect portion. This segmentation allows the reservoir to be formed with relaxed alignment tolerances while the interconnect portion self-aligns with the opening through thermal expansion, resolving the contradiction between manufacturing precision and design flexibility
Solution Approach 2:
The reservoir of conductive material is pre-formed adjacent to the opening before the interconnect is created. This preliminary action stores conductive material in a convenient location that will later expand into the opening through thermal expansion, enabling flexible design placement while ensuring precise interconnect formation
2Ease of manufacture
If conductive material is placed only adjacent to openings, then manufacturing simplicity is improved, but design versatility deteriorates
Solution Approach 1:
The conductive material reservoir is extended into a remote portion located at a different lateral location from the opening. This dimensional extension provides additional design versatility by allowing interconnects to be formed from remote locations while maintaining manufacturing simplicity through the thermal expansion process
3Adaptability or versatility
If remote reservoirs of conductive material are used, then design flexibility is improved, but manufacturing complexity deteriorates
Solution Approach 1:
The manufacturing process utilizes thermal expansion parameter changes to simplify complexity. By heating the reservoir, the conductive material expands volumetrically to form the interconnect, transforming a potentially complex alignment and deposition process into a simple thermal treatment step that achieves precise interconnect formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables robust and well-connected semiconductor devices by providing multiple locations for conductive material, reducing design constraints and enabling a wider range of design possibilities.
Implementation Method 1
The reservoir of conductive material is heated to expand the reservoir of conductive material and form an interconnect electrically coupling the first semiconductor die and the second semiconductor die
Data Source
AI summary
This document discloses techniques, apparatuses, and systems for semiconductor device circuitry formed from remote reservoirs. A semiconductor assembly includes a first semiconductor die with a layer of dielectric material having an opening. The first semiconductor die further includes a reservoir of conductive material having a first portion located adjacent to the opening, a second portion remote from the opening, and a third portion coupling the first portion and the second portion. A second semiconductor die includes a layer of dielectric material and a contact pad corresponding to the opening. The reservoir of conductive material is heated to volumetrically expand the second portion into the third portion, the third portion into the first portion, and the first portion through the opening to form an interconnect electrically coupling the first semiconductor die and the second semiconductor die at the contact pad. In this way, a connected semiconductor device may be assembled.