Removable Adhesive Carrier Substrate for Semiconductor Warpage Control
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Solution Overview
Problem
Semiconductor packaging processes face challenges with warpage due to differences in thermal expansion coefficients between carrier substrates and components, leading to stress and potential interruptions in the packaging process.
Innovation Solution
A carrier substrate with multiple layers, including a first and second layer with different coefficients of thermal expansion, and removably attached glue layers, allows for controlled thermal processes and stepwise adjustment of thermal expansion to match components, preventing warpage and maintaining packaging integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer carrier substrate is used, then the structure is simple and manufacturing is easy, but warpage occurs due to thermal expansion coefficient mismatch during heating processes
Solution Approach 1:
The carrier substrate is divided into multiple layers (first layer, second layer, and optionally third layer) with different thermal expansion coefficients. Each layer is segmented to perform specific functions: the first layer provides base support, the second layer compensates for thermal expansion, and the third layer (if present) provides additional stability. This segmentation allows the substrate to maintain dimensional stability during heating while keeping the overall structure relatively simple.
Solution Approach 2:
The patent employs composite material construction by combining layers with different thermal expansion coefficients. The first layer typically has a lower thermal expansion coefficient while the second layer has a higher coefficient, creating a composite structure that balances thermal stresses. This composite approach resolves the warpage issue without requiring complex single-material solutions.
2Manufacturing precision
If multiple layers with different thermal expansion coefficients are used, then warpage is reduced, but the device structure becomes more complex
Solution Approach 1:
The multi-layer structure is segmented into distinct functional layers with clear interfaces. The first layer serves as the base substrate, the second layer as the thermal compensation layer, and the third layer (when used) as the protective/stabilizing layer. This segmentation makes the complex structure manageable and easier to manufacture through sequential lamination processes.
Solution Approach 2:
The patent controls the thermal expansion parameters of each layer to achieve overall dimensional stability. By carefully selecting materials with specific thermal expansion coefficients for each layer and controlling their thickness ratios, the composite substrate maintains dimensional stability during heating without requiring overly complex structural designs.
3Strength
If strong adhesive layers are used to bond carrier substrate layers, then bonding strength is high, but residue remains after carrier removal affecting packaging quality
Solution Approach 1:
The adhesive layer's bonding characteristics are made dynamic rather than static. The adhesive is formulated to provide strong bonding strength during the packaging process (at elevated temperatures) but becomes removable under specific conditions (such as solvent exposure or temperature changes). This dynamic behavior allows the adhesive to serve dual functions: strong bonding during manufacturing and clean removal during carrier substrate detachment.
Solution Approach 2:
The adhesive material's physical or chemical parameters are changed based on process conditions. The adhesive may undergo phase changes, solubility changes, or bond strength changes in response to temperature, solvent exposure, or other environmental factors. This parameter change capability allows the adhesive to be strongly bonded during assembly but easily removed without residue after the carrier substrate serves its purpose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces warpage and stress in semiconductor packages, enables continuous high-speed packaging processes, and increases yield while allowing for flexible selection of materials, thus reducing process costs and limitations in raw material development.
Implementation Method 1
a first glue layer (131) between the first layer (111) and the second layer (113), wherein the first glue layer (131) is removably attached to the first layer (111)
Implementation Method 2
A carrier substrate with multiple layers, including a first and second layer with different coefficients of thermal expansion, allows for controlled thermal processes and stepwise adjustment of thermal expansion to match components
Data Source
AI summary
A carrier substrate and a packaging method, the carrier substrate including a first layer; a second layer; and a first glue layer between the first layer and the second layer, wherein the first glue layer is removably attached to the first layer.