Removable Protective Film Composition for Diced Semiconductor Chips

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Solution Overview

Problem

Existing methods for forming protective films on semiconductor chips are complex and do not adequately protect chips during transportation, and the films are difficult to remove after use.

Innovation Solution

A semiconductor chip-manufacturing protective film-forming composition that includes a polymer and a solvent, with the polymer selected from a phenolic hydroxy group-containing polymer, a carboxy group-containing polymer, and a blocked carboxy group-containing polymer, forming a protective film that can be dissolved in alkaline, acidic, or neutral removing liquids, with a thickness of 1 to 10 µm, and containing a crosslinking agent, an acid catalyst, and additives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protective film-forming film is attached to a semiconductor substrate before dicing, then the semiconductor chip is protected from damage during transportation, but the manufacturing process becomes more complex and the film is difficult to remove

Engineering Contradiction:

Improveprotection from damage during transportationVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by selecting specific polymer types (phenolic hydroxy group-containing, carboxy group-containing, or blocked carboxy group-containing polymers) with controlled molecular weights and compositions. These parameter changes enable the protective film to be easily removable while maintaining protection during transportation, thus resolving the contradiction between reliability and manufacturing complexity.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a protective film is formed on the semiconductor chip, then damage during transportation is prevented, but the film removal process becomes difficult and time-consuming

Engineering Contradiction:

Improveprotection during transportationVSAvoidfilm removal time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent changes the chemical parameters of the protective film by using specific polymer compositions (phenolic hydroxy group-containing, carboxy group-containing, or blocked carboxy group-containing polymers) that can be easily removed by conventional methods, thereby reducing film removal time while maintaining transportation protection.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The protective film is designed as a temporary protective layer that is discarded after serving its purpose during transportation. The film is intentionally made easy to remove so that it can be quickly discarded after the transportation phase, reducing time loss in the manufacturing process.

Inventive Principle:

Principle #34Discarding and recovering

3Reliability

If a complex protective film-forming method is used, then the protective film provides adequate protection, but the apparatus configuration and operation procedure become more complex

Engineering Contradiction:

Improveprotective film effectivenessVSAvoidmanufacturing method simplicity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent simplifies the manufacturing method by changing the parameters of the protective film composition to use commercially available polymers with specific functional groups. This allows the protective film to be formed using simple coating and drying processes without requiring complex apparatus configurations or multi-step operation procedures, while still providing adequate protection.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition allows for a simpler method to form a protective film that protects semiconductor chips during transportation and can be easily removed, reducing damage and simplifying the manufacturing process.

Implementation Method 1

a coating step of coating the semiconductor chip-manufacturing protective film-forming composition on the semiconductor substrate, and a drying step of drying the coated semiconductor chip-manufacturing protective film-forming composition

Methodology Applied

Scientific EffectEvaporation: Evaporation

Implementation Method 2

the semiconductor chip-manufacturing protective film-forming composition forms a protective film that can be dissolved in an alkaline removing liquid, an acidic removing liquid, a neutral removing liquid, or an organic solvent

Methodology Applied

Scientific EffectDissolution: Solvation

Data Source

PatentEP4668315A1Composition for forming protective film for semiconductor chip manufacture, semiconductor substrate, semiconductor chip, and method for manufacturing semiconductor chip

Publication Date: 2025.12.24 NISSAN CHEM CORP

Figure 1~2B
Figure 3~5A
Figure 5B~6

AI summary

Provided is a semiconductor chip-manufacturing protective film-forming composition capable of easily forming a semiconductor chip-manufacturing protective film to be disposed on a semiconductor chip in order to provide, by a simpler method, a semiconductor chip with a protective film capable of protecting a semiconductor chip from damage accompanying transportation when an individual semiconductor chip obtained by dicing a semiconductor substrate is transported. A semiconductor chip-manufacturing protective film-forming composition for preventing damage to a circuit surface or a back surface of a semiconductor substrate or a semiconductor chip, the semiconductor chip-manufacturing protective film-forming composition containing a polymer and a solvent, wherein the polymer is selected from a phenolic hydroxy group-containing polymer and a carboxy group-containing polymer.