Removable Coating Film Composition for Clean Semiconductor Peeling

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Solution Overview

Problem

Existing methods fail to completely remove adhesive residues from semiconductor substrates during the bonding and peeling process, especially when high-temperature treatments are involved, leading to foreign matter residues that cannot be effectively cleaned with conventional solvents.

Innovation Solution

A composition for forming a coating film containing a polymer with a specific structural unit and a solvent, which forms a removable film that can withstand high temperatures and is easily removed with an alkaline liquid, along with optional crosslinking agents and additives, to prevent adhesive residue on semiconductor substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an adhesive layer is used to bond the semiconductor substrate to the support substrate, then the bonding strength and heat resistance are improved, but adhesive residues remain on the substrate after peeling

Engineering Contradiction:

Improvebonding strengthVSAvoidadhesive residues

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

A coating film is introduced as an intermediary layer between the semiconductor substrate and the adhesive layer. This coating film serves as a mediator that prevents direct contact between the adhesive and the semiconductor substrate, thereby preventing adhesive residues from contaminating the substrate while still allowing effective bonding through the adhesive layer.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The bonding system is segmented into distinct functional layers: the semiconductor substrate, the coating film (as a separate protective layer), and the adhesive layer. This segmentation allows each layer to perform its specific function independently - the coating film protects the substrate from adhesive contamination while the adhesive provides bonding strength.

Inventive Principle:

Principle #1Segmentation

2Ease of operation

If conventional solvents are used to clean adhesive residues, then the cleaning process is simple, but the residues cannot be completely removed

Engineering Contradiction:

Improvecleaning simplicityVSAvoidresidue removal completeness

Core Design Contradiction:

Ease of operationVSManufacturing precision

Solution Approach 1:

The coating film acts as a sacrificial intermediary layer that absorbs the adhesive residues, protecting the semiconductor substrate from direct contact with the residues. This allows the substrate to be cleaned more effectively since the residues are concentrated on the coating film surface rather than being embedded in the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The coating film converts the harmful effect of adhesive residues into a beneficial outcome by providing a removable surface where residues can be contained and easily eliminated. The coating film itself is designed to be removable, transforming the potential contamination problem into a controlled removal process.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Adaptability or versatility

If high-temperature treatment is applied to the substrate, then the processing capability is improved, but the adhesive residues become more difficult to remove

Engineering Contradiction:

Improveprocessing capabilityVSAvoidresidue removal difficulty

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The coating film is applied to the semiconductor substrate before any high-temperature processing or adhesive bonding occurs. This preliminary protective layer prevents adhesive residues from directly contacting the substrate during subsequent high-temperature treatments, ensuring that the substrate remains clean even after aggressive processing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The coating film serves as a thermal and chemical barrier between the semiconductor substrate and the adhesive layer during high-temperature processing. It mediates the interaction by withstanding the processing conditions while protecting the substrate from residue formation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively prevents adhesive residue from remaining on semiconductor substrates by using a heat-resistant coating film that can be easily removed, ensuring clean substrates for further processing.

Implementation Method 1

the polymer is a polymer containing a structural unit represented by the following Formula (1)... a coating film for removing foreign matters having heat resistance

Methodology Applied

Scientific EffectThermal stability:

Implementation Method 2

the composition being capable of forming a coating film that is removable with a removing liquid... cleaned with a removing liquid to remove the coating film

Methodology Applied

Scientific EffectChemical dissolution:

Data Source

PatentUS20250361419A1Composition for forming coating film for removing foreign matters and semiconductor substrate

Publication Date: 2025.11.27 NISSAN CHEM CORP

AI summary

A composition for forming a coating film for removing foreign matters includes: a polymer; and a solvent, the composition being capable of forming a coating film that is removable with a removing liquid, in which the polymer is a polymer containing a structural unit represented by the following Formula (1):where in Formula (1), X represents an oxygen atom or NR, and R represents a hydrogen atom or a protecting group of an imide group that is deprotected by alkali.