Removable transparent cover for image sensor packages
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Solution Overview
Problem
The challenge in image sensor technology is to reduce the size and cost of packaging while maintaining optical performance, as existing methods often require lateral rotation of protective covers, which can damage neighboring components on printed circuit boards and limit the proximity of other components to the image sensor.
Innovation Solution
Implementing a removable transparent cover that can be lifted away from the image sensor package along the Z-axis without lateral rotation, allowing for closer component placement and reduced thickness, achieved through a design with an overhang portion and notch for easy de-bonding without disturbing neighboring components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the protective cover is removed by lateral rotation, then the cover can be removed from the image sensor package, but neighboring components on the printed circuit board may be damaged or collided
Solution Approach 1:
The patent changes the cover removal direction from lateral rotation (X-Y plane) to vertical lifting along the Z-axis. The cover is designed with an overhang portion that extends beyond the package edges, allowing a lifting tool to engage and remove the cover vertically without rotating it laterally, thus avoiding collision with neighboring components
Solution Approach 2:
The cover design includes an overhang portion that is segmented from the main cover body, creating a distinct engagement feature. This overhang portion can be independently accessed by lifting tools, enabling selective engagement and removal without affecting the entire package structure or surrounding components
2Reliability
If the protective cover remains bonded to the image sensor package, then optical performance is maintained, but the overall thickness and footprint of the package increase
Solution Approach 1:
The patent transforms the cover from a permanently fixed state to a dynamically removable state. The cover is initially bonded to protect the sensor during operation, maintaining optical performance, but can be removed when needed to reduce package thickness and footprint, allowing the structure to adapt between protected and minimized states
Solution Approach 2:
The patent extracts the protective cover function from the permanent package structure. By making the cover removable through the overhang design, the optical protection function can be separated from the final package configuration, allowing the cover to be taken out when thickness reduction is required while maintaining protection when bonded
3Area of stationary object
If other components are placed closer to the image sensor, then the device footprint is reduced, but lateral rotation of the protective cover would collide with these components
Solution Approach 1:
The patent resolves the spatial conflict by changing the cover removal operation from the X-Y plane (lateral rotation) to the Z-axis (vertical lifting). This dimensional change allows components to be placed closer in the X-Y plane without interfering with cover removal, as the removal operation now occurs in a different spatial dimension where there is no collision risk
Data Source
AI summary
An imaging package includes an image sensor package formed with a semiconductor substrate. A removable transparent cover is bonded over the image sensor package to cover a first side the image sensor package. A lateral dimension of the removable transparent cover along a first direction is larger than a lateral dimension of the image sensor package along the first direction. An overhang portion of the removable transparent cover is defined by an exposed portion of the removable transparent cover that extends beyond a lateral side of the image sensor package along the first direction.