Resilient Interface for Substrate Protection Against Thermal Runaway

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Solution Overview

Problem

Substrates and components connected to them can suffer damage due to thermal runaway caused by electrical shorts, leading to excess current, resistive heating, and potential fires, making it challenging to prevent damage to both the substrate and adjacent components.

Innovation Solution

An interface made of resilient material is used, which undergoes a state change at a specific temperature, physically transforming to separate the component from the substrate, disrupting the electrical connection and mitigating further damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a discrete component is operatively coupled to the substrate, then electrical connection and functionality are achieved, but thermal runaway from electrical shorts can cause damage to the substrate and surrounding components

Engineering Contradiction:

Improvecomponent functionalityVSAvoidthermal damage to substrate

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The interface acts as an intermediary element positioned between the discrete component and the substrate. It provides the necessary electrical and mechanical connection while simultaneously serving as a protective barrier that limits thermal propagation from component failure to the substrate, thus resolving the contradiction between maintaining reliability and preventing thermal damage.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The interface is designed with inherent thermal management properties that cushion against thermal runaway before it can affect the substrate. By anticipating potential electrical shorts and thermal events, the interface structure预先 provides thermal isolation and energy dissipation pathways, preventing catastrophic damage while maintaining normal operational connectivity.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Use of energy by moving object

If excess current flows through the discrete component, then electrical functionality is maintained, but resistive heating leads to thermal runaway and component failure

Engineering Contradiction:

Improveelectrical current flowVSAvoidresistive heating temperature

Core Design Contradiction:

Use of energy by moving objectVSTemperature

Solution Approach 1:

The interface extracts and isolates the thermal management function from the electrical connection function. By separating these functions, the interface can focus on providing electrical connectivity while independently managing thermal effects through its material properties and structural design, allowing excess heat to be dissipated or contained without affecting the electrical functionality.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If the component remains connected to the substrate during thermal events, then electrical connection is maintained, but damage propagates to the substrate and surrounding devices

Engineering Contradiction:

Improveelectrical connection continuityVSAvoiddamage propagation

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The interface segments the system into distinct functional zones: the discrete component, the interface itself, and the substrate. This segmentation allows the interface to act as an independent buffer zone that can withstand or contain thermal events, preventing damage propagation while maintaining electrical connectivity during normal operation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The interface effectively limits damage by isolating the failing component, allowing the substrate and other components to remain operational and reducing the risk of thermal runaway, thus preventing extensive damage.

Implementation Method 1

the interface, is configured to change state, e.g. from a first state to a second state, with the second state including a physical transformation of the resilient material

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 2

Responsive to exposure of the interface to a thermal event that meets or exceeds a first temperature, the interface, is configured to change state

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS10342122B2Interface for limiting substrate damage due to discrete failure

Publication Date: 2019.07.02 INTERNATIONAL BUSINESS MACHINE CORPORATION

AI summary

An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.