Radiation-Sensitive Resin Composition for Fine Pattern Resolution
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Solution Overview
Problem
Chemically-amplified radiation-sensitive resins struggle to maintain precise control over acid diffusion for forming fine patterns with high resolution and small line width roughness, especially when exposed to deep ultraviolet rays, leading to issues with pattern accuracy and collapse.
Innovation Solution
A radiation-sensitive resin composition incorporating an acid-labile group-containing resin and a specific compound that controls acid diffusion, along with a photoacid generator, to create a resist pattern with improved resolution and shape retention, even for fine line patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If deep ultraviolet rays are applied to a chemically-amplified radiation-sensitive resin composition, then high sensitivity and resolution are achieved, but acid diffusion control becomes difficult leading to pattern collapse
Solution Approach 1:
The patent introduces a basic compound as an intermediary substance that mediates between the generated acid and the resin system. This basic compound acts as an acid diffusion controller, absorbing and regulating acid movement in the unexposed areas, thereby preventing pattern collapse while preserving the high resolution achieved through deep ultraviolet exposure.
Solution Approach 2:
The patent modifies the chemical parameters of the radiation-sensitive resin composition by incorporating a basic compound with specific properties (pKa value, molecular weight, structural features). This parameter change enables precise control over acid diffusion behavior, allowing the system to maintain both high sensitivity and pattern stability under deep ultraviolet exposure.
2Manufacturing precision
If acid diffusion is controlled to form fine patterns, then line width roughness decreases, but pattern shape control becomes challenging
Solution Approach 1:
The basic compound provides localized acid diffusion control with different characteristics in exposed versus unexposed areas. In unexposed areas, it actively controls acid diffusion to smooth line width variations. In exposed areas, the acid-labile groups ensure complete deprotection. This spatially differentiated functionality simultaneously achieves fine line width control and accurate rectangular pattern shapes.
Solution Approach 2:
The radiation-sensitive resin composition is designed as a composite system combining the acid-labile group-containing resin with a basic compound having specific structural features. This composite material approach integrates two complementary functionalities: the resin provides pattern-forming capability while the basic compound provides acid diffusion control, together achieving both line width uniformity and shape accuracy.
3Reliability
If a basic compound is added as an acid diffusion controller, then acid diffusion rate is adjusted, but the compound may dissociate and lose controllability
Solution Approach 1:
The basic compound is designed with specific parameter ranges: pKa value of 3 to 8, molecular weight of 100 to 1000, and specific structural features. These parameter specifications ensure the compound remains stable and maintains acid diffusion control capability throughout the exposure and development process, preventing dissociation and loss of controllability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves small line width roughness and prevents pattern collapse, ensuring accurate and stable resist patterns when exposed to deep ultraviolet rays, with enhanced sensitivity and developability.
Implementation Method 1
When applying deep ultraviolet rays (e.g., KrF excimer laser light or ArF excimer laser light) or the like to a chemically-amplified radiation-sensitive resin composition, an acid is generated in the exposed area
Implementation Method 2
a difference in solubility rate in a developer occurs between the exposed area and the unexposed area due to chemical reactions catalyzed by the acid
Implementation Method 3
an acid diffusion controller that dissociates due to an acid and loses acid diffusion controllability has attracted attention since high contrast between the exposed area and the unexposed area is obtained
Data Source
AI summary
A radiation-sensitive resin composition includes an acid-labile group-containing resin, and a compound shown by the following general formula (i). R1 represents a hydrogen atom or the like, R2 represents a single bond or the like, R3 represents a linear or branched unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms or the like, and X+ represents an onium cation.