Resin Adhesive Layer for Stacked Semiconductor Crack Resistance
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Solution Overview
Problem
Semiconductor devices with stacked memory chips face challenges in suppressing cracks in the adhesive layer due to thermal stress, leading to potential wire breaks and defects, especially as the number of stacked chips increases.
Innovation Solution
A resin-containing layer with a breaking strength of 15 MPa or more at 125°C is used to bond semiconductor chips to the wiring board, composed of a cured product of an epoxy resin-acrylic rubber mixture with silica particles, which effectively withstands thermal cycling and reduces the likelihood of cracks and wire breaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of stacked memory chips is increased to achieve miniaturization and high functionality, then the device density and functionality are improved, but the risk of crack occurrence in the adhesive layer increases
Solution Approach 1:
The patent changes the material parameters of the adhesive layer by incorporating acrylic rubber particles (1-50 μm diameter) into the epoxy resin matrix. This composition modification increases the breaking strength from conventional levels to 15 MPa or more at 125°C, enabling the adhesive to withstand thermal stress in high-stack configurations without cracking
Solution Approach 2:
The patent creates a composite adhesive material by combining epoxy resin with acrylic rubber particles. This composite structure provides both the bonding strength of epoxy and the flexibility/crack resistance of rubber, allowing the adhesive layer to accommodate thermal expansion differences while maintaining integrity under stacked chip configurations
2Ease of manufacture
If conventional adhesive materials are used in multistage stacked structures, then manufacturing simplicity is maintained, but wire breaks and defects occur due to adhesive layer cracks
Solution Approach 1:
The patent modifies the adhesive material composition by adding acrylic rubber particles to epoxy resin, achieving a breaking strength of 15 MPa or more at 125°C. This parameter change prevents adhesive layer cracks that would otherwise cause wire breaks, thereby maintaining wire integrity without complicating the manufacturing process
Solution Approach 2:
The acrylic rubber particles act as cushioning elements within the adhesive layer, absorbing and distributing thermal stress before it can propagate into cracks. This preemptive stress distribution prevents wire breaks from occurring in the first place, maintaining reliability while keeping manufacturing simple
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin-containing layer with enhanced breaking strength prevents cracks and wire breaks during thermal cycling, enhancing the reliability and durability of semiconductor devices with multiple stacked chips, thereby improving the device's resistance to thermal stress.
Implementation Method 1
there is a possibility that the crack occurs in the FOD material bonded to the wiring board, board wiring undergoes rupture
Implementation Method 2
the resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.
Data Source
AI summary
A semiconductor device of an embodiment includes: a wiring board; a semiconductor chip mounted on the wiring board; and a resin-containing layer bonded on the wiring board so as to fix the semiconductor chip to the wiring board. The resin-containing layer contains a resin-containing material having a breaking strength of 15 MPa or more at 125° C.