Radiation-Sensitive Resin Composition for High-Resolution Resist Patterns
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Solution Overview
Problem
Chemically-amplified radiation-sensitive resin compositions face challenges in achieving high resolution and smooth pattern formation with line widths of 90 nm or less, requiring improved properties such as line width roughness, mask error enhancement factor, iso-dense bias, and storage stability, which existing acid generators and resins have not adequately addressed.
Innovation Solution
A radiation-sensitive resin composition comprising a resin with specific acid-labile groups, a radiation-sensitive acid generator, an acid diffusion controller, and a mixed solvent, including propylene glycol monomethyl ether acetate, to control acid diffusion and enhance resist performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional acid generators are used to achieve high resolution, then line width can be reduced to 90 nm or less, but line width roughness and storage stability deteriorate
Solution Approach 1:
The patent changes the chemical parameters of the acid generator by using a carboxylic acid compound with specific molecular weight (500-2000) and specific structural features (at least one carboxylic acid group and at least one of hydroxyl, ether, or ester groups). This parameter optimization resolves the contradiction by achieving both high resolution (90 nm or less) and improved storage stability simultaneously.
Solution Approach 2:
The patent creates a composite resist composition by combining the carboxylic acid compound acid generator with specific resins (polycyclic olefin, polyhydroxystyrene, or phenolic resin) and acid diffusion controllers. This composite approach allows the system to achieve high resolution while maintaining storage stability and reducing line width roughness through synergistic interactions between components.
2Manufacturing precision
If acid diffusion is increased to improve sensitivity, then manufacturing precision improves, but line width roughness worsens
Solution Approach 1:
The patent optimizes the molecular weight parameter of the carboxylic acid compound (500-2000) and its structural parameters (specific functional groups) to control acid diffusion characteristics. This parameter optimization enables improved pattern formation with reduced line width roughness by achieving balanced acid diffusion that enhances sensitivity without excessive spreading.
Solution Approach 2:
The patent introduces an acid diffusion controller as an intermediary component that mediates between the carboxylic acid compound and the resin. This intermediary substance (10-1000 times less in amount than the acid generator) fine-tunes acid diffusion to improve pattern formation while suppressing line width roughness through controlled acid distribution.
3Reliability
If existing acid generators are used, then chemically-amplified resist function is achieved, but mask error enhancement factor and iso-dense bias performance are insufficient
Solution Approach 1:
The patent changes the fundamental chemical parameters of the acid generator from conventional sulfonic acid compounds to carboxylic acid compounds with specific molecular weight (500-2000) and functional group composition. This parameter transformation improves mask error enhancement factor and iso-dense bias performance while maintaining reliable chemically-amplified resist function through optimized acid generation characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves improved resolution, reduced line width roughness, and enhanced storage stability, enabling the formation of precise resist patterns with improved process stability and sensitivity.
Implementation Method 1
A chemically-amplified radiation-sensitive resin composition generates an acid when exposed to deep ultraviolet rays (e.g., KrF excimer laser or ArF excimer laser) or electron beams
Implementation Method 2
an acid diffusion controller, and a mixed solvent... to control acid diffusion
Data Source
AI summary
A radiation-sensitive resin composition includes a resin, a radiation-sensitive acid generator, an acid diffusion controller, and a mixed solvent. The radiation-sensitive acid generator includes a compound (I) shown by a following general formula (I). The mixed solvent includes about 50 mass % to about 90 mass % of propylene glycol monomethyl ether acetate,wherein M+ represents a sulfonium cation or an iodonium cation, R represents a hydrogen atom or a hydrocarbon group having 1 to 8 carbon atoms, Rf represents a fluorine atom or a perfluoroalkyl group having 1 to 4 carbon atoms, n represents an integer from 1 to 10, and m represents an integer from 1 to 4.