Resin Composition for High-Density Interconnects
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Solution Overview
Problem
Epoxy resin-based dielectric materials in printed circuit boards face challenges with poor thermal resistance, warpage, adhesion to metal foils, and unsatisfactory electrical properties, limiting their application in high-density interconnect designs and lead-free processes.
Innovation Solution
A resin composition combining epoxy resin, a specific bismaleimide resin, and a resin with a specific structure, along with a cross-linking agent, fillers, and optional additives like core/shell rubber and flame retardants, to enhance thermal resistance, peeling strength, and electrical properties while minimizing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If bismaleimide resin is added to epoxy resin-based dielectric materials to improve thermal resistance, then thermal resistance is improved, but adhesion property to metal foils deteriorates
Solution Approach 1:
The patent uses a composite resin system combining epoxy resin, bismaleimide resin, and phenolic resin in specific proportions. This composite approach allows the material to achieve both improved thermal resistance from the BMI component and maintained adhesion properties through the epoxy and phenolic resin components, resolving the contradiction between thermal performance and metal foil adhesion.
2Temperature
If bismaleimide resin is added to epoxy resin-based dielectric materials to improve thermal resistance, then thermal resistance is improved, but electrical properties deteriorate
Solution Approach 1:
The composite resin system balances the electrical properties by combining BMI resin (for thermal resistance) with epoxy resin and phenolic resin (for electrical performance). The specific formulation ensures that the dissipation factor and dielectric constant remain within acceptable ranges while achieving the desired thermal resistance improvement.
3Productivity
If epoxy resin-based dielectric materials are used in high-density interconnect designs, then circuit density is improved, but warpage increases
Solution Approach 1:
The patent modifies the chemical composition parameters of the dielectric material by incorporating phenolic resin and specific ratios of epoxy and BMI resins. This changes the thermal and mechanical properties of the material, reducing the coefficient of thermal expansion mismatch and thereby reducing warpage in HDI circuit boards while maintaining high circuit density capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition improves thermal resistance, peeling strength, and electrical properties of electronic materials, reducing warpage and maintaining good alkali resistance, making it suitable for high-density interconnect designs and lead-free processes.
Implementation Method 1
Bismaleimide resin has two functional groups, i.e., two reactive carbon-carbon double bonds, such that the molecules of bismaleimide resin can undergo crosslinking reaction through heat or in the presence of a catalyst.
Implementation Method 2
The resin composition improves thermal resistance, peeling strength, and electrical properties of electronic materials
Implementation Method 3
The resin composition improves thermal resistance, peeling strength, and electrical properties of electronic materials
Data Source
AI summary
A resin composition is provided. The resin composition comprises the following components:(A) epoxy resin;(B) a cross-linking agent;(C) bismaleimide resin (BMI) represented by the following formula (I):wherein R1 is an organic group; and(D) a resin represented by the following formula (II):wherein n is an integer of 1 to 10.