Resin Composition for Wafer Level Package Adhesion
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Solution Overview
Problem
Current resin compositions for electronic devices lack excellent heat resistance, adhesion to substrates, solder heat resistance, and thermal shock resistance, particularly in high-density interconnect devices where new materials with improved electrical characteristics are sought.
Innovation Solution
A resin composition comprising a binder resin, a phenoxy resin with a hydroxyl equivalent of 300 or more, and a cross-linking agent, including a cyclic olefin polymer with protic polar groups and an alicyclic epoxy compound, along with a filler and photoacid generator, to enhance the resin film's properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyfunctional monomers with multiple polymerizable groups are used to improve crosslinking density and mechanical properties, then strength and durability are improved, but the resin composition becomes more complex and may cause incomplete curing or yellowing
Solution Approach 1:
The patent divides the crosslinking function into separate components: a polyfunctional monomer for crosslinking and a photopolymerization catalyst system with multiple catalysts having different activation energies. This segmentation allows each component to perform its specific function optimally without the complexity and side effects of polyfunctional monomers with multiple polymerizable groups.
Solution Approach 2:
The patent uses a composite catalyst system comprising multiple photopolymerization catalysts with different activation energies (first catalyst with lower activation energy, second catalyst with higher activation energy). This composite approach enables complete curing at lower UV irradiation energies while avoiding the complexity and yellowing issues associated with polyfunctional monomers.
2Reliability
If high UV irradiation energy is applied to ensure complete polymerization, then curing completeness is improved, but yellowing of the cured product increases
Solution Approach 1:
The patent changes the parameter of catalyst activation energy by selecting multiple catalysts with different activation energies. The first catalyst (lower activation energy) activates at lower UV energies to initiate polymerization, while the second catalyst (higher activation energy) activates at higher UV energies to complete crosslinking. This parameter differentiation enables complete curing at lower overall UV irradiation energy, reducing yellowing.
Solution Approach 2:
The patent implements a staged polymerization process where different catalysts activate at different UV irradiation energy levels. The first catalyst operates during lower energy irradiation to establish the polymer network, and the second catalyst operates during higher energy irradiation to complete crosslinking, achieving complete curing without excessive yellowing.
3Ease of manufacture
If conventional resin compositions are used to maintain simplicity, then ease of manufacture is preserved, but adhesion to inorganic particles and mechanical properties deteriorate
Solution Approach 1:
The patent introduces a polyfunctional monomer as an intermediary that bridges the organic polymer matrix and inorganic particles. The polyfunctional monomer's multiple reactive groups enable it to bond with both the polymer chains and the inorganic particle surfaces, significantly improving adhesion while maintaining manufacturing simplicity through straightforward mixing and curing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition provides a film with superior heat resistance, adhesion, solder heat resistance, and thermal shock resistance, suitable for advanced electronic devices, particularly in wafer level package technology.
Implementation Method 1
a photopolymerization catalyst and a polymerizable group capable of forming a crosslinked structure upon polymerization in the presence of a photopolymerization catalyst
Data Source
AI summary
A resin composition comprising a binder resin (A), a phenoxy resin having a hydroxyl equivalent of 300 or more, and a cross-linking agent (C). The resin composition of the present invention preferably further comprises a photoacid generator (D). The photoacid generator (D) is more preferably a quinone diazide compound.