Electroluminescent Light Sources TRIZ Cases

A hole transport layer mixture of two materials with distinct HOMO levels improves OLED power efficiency.

Alternating inorganic and diisocyanate organic layers resolve pinhole defects while maintaining high moisture barrier properties for display reliability.

A light-emitting device adjusts driving signals using measured surrounding temperature to correct OLED brightness variations.

Four-step patterning reduces mask count and manufacturing cost for organic thin film transistor array substrates while maintaining component formation quality.

Sigma delta modulation diversifies LED switching times via a combiner, reducing electromagnetic interference and ensuring even brightness distribution.

A printing mask with a cover part shields the non-display area during organic light emitting liquid deposition.

A composite cathode interface layer reduces drive voltage in organic light emitting diodes.

Removing ITO from the anode stack boosts luminance while oxygen trapping prevents water ingress that degrades the organic layer.

A stacked optoelectronic device integrates light-emitting diodes and control circuits on opposing faces of a semiconductor substrate.

Heated gas lamination reduces initial inner pressure to prevent contact electrode failure during high temperature reliability tests.

Segmented yellow and red phosphor layers convert blue LED light to achieve an average color rendering index of 95 or more.

Extended vapor-deposited films buffer adjacent light emitting regions, preventing color mixture caused by mask misplacement during deposition.

A time-delay lighting circuit uses a capacitor to maintain illumination after power disconnection.

Segmented polarization separation layers reflect unwanted light states while transmitting useful emission, resolving brightness loss from circular polarizers.

Auxiliary lines extend from pixel circuits to connecting bars outside scribe lines, enabling defect detection without damaging expensive driving units.

An aromatic amine derivative enhances blue emission in organic electroluminescent elements through specific molecular configurations.

A transparent organic light-emitting device uses alternating emissive and non-emissive zones to maintain optical clarity.

An LED driver retrieves configuration data from a fixture database to set operational parameters.

A polymeric binder with weight average molecular weight at least 8,000,000 g/mol improves film forming in organic electronic device inks.

Laminated reflective layers filter harmful UV wavelengths to prevent thermal damage during encapsulation curing, preserving organic thin film integrity.

Mixed-valence metal oxide crystals enable efficient hole conduction, reducing driving voltage and resistance in organic EL displays.

A constant current circuit paired with a bypass path maintains stable power delivery to electrical loads.

Isolation channels provide escape paths for gaseous products during laser irradiation, preventing collisions and ensuring complete device detachment.

A ballasted LED lamp drive power supply uses switch-based circuits to manage variable power and energy saving.

Varying black matrix thermal conductivity suppresses temperature rises and prolongs lifespan without requiring uniform high-quality materials.

An emission driver uses only PMOS transistors to integrate directly with pixel units.

Multi-tone masks define patterns simultaneously to reduce photolithography steps while maintaining transistor precision.

An LED drive circuit ramps current via a DAC and counter to prevent electromagnetic interference without costly shielding.

Electro-optic components dynamically adjust beam direction, replacing multiple fixed fixtures with one adaptable luminaire.

A light emitting device mounts a protective element on an electrically conductive member and covers it with a base to position the light source closer to the opening.

Phase angle shift unit minimizes input line current phase angle using timed MOSFET switching, improving power factor and extending LED lifespan.

A light-emitting element uses quantum dot interference to control angular brightness distribution.

A hole injection layer with specific thickness ranges generates resonance to improve light emission efficiency in organic light emitting devices.

Rectangular wave pixel electrodes limit side length to block particle bridges, resolving etch rate induced short-circuits.

Photochromic materials in the display filler absorb ambient light at 470-490 nm and 550-580 nm, reducing glare and improving outdoor visibility.

Multi-stage switched capacitor converter adjusts conversion ratios via synchronized charging to provide precise voltage regulation.

A third inorganic film with higher wettability controls organic resin spreading during inkjet deposition to form precise peripheral seals.

A resin composition with high hydroxyl phenoxy resin and cross-linking agent enhances film adhesion.

An epoxy or polyimide buffer prevents getter-cathode contact during cap deflection, preserving moisture absorption and device reliability.

Discretely distributed organic barrier layers within a composite stack enhance moisture resistance while maintaining device bendability.

A top emission organic EL element uses a surfactant dispersant to maintain lower electrode thickness at 150 nm or more.

A cascade dimming circuit adjusts primary and secondary voltages to control LED brightness.

An organometallic compound featuring specific structural moieties enhances energy transfer and luminescent efficiency in organic light-emitting devices.

A light-emitting element structure with distinct functional layers stabilizes driving voltage and reduces resistance across film thickness variations.

A mobile terminal captures visible light signals to identify lighting devices and transmit control commands.

A light-emitting device uses a naphthofuropyrazine host and phosphorescent guest to optimize energy transfer efficiency.

A switched capacitor network stabilizes error amplifier voltage during PWM cycles to reduce startup transients in LED backlight circuits.

Replacing laser hardening with diffuse thermal radiation minimizes stress concentration and prevents crack defects at the cutting surface.

A magnetic deposition apparatus applies attractive force to support a moving unit without contact.