Resin Core Conductive Lines for Foldable Display Durability
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Solution Overview
Problem
Flexible display devices face the risk of line breakage and loss of conductivity when folded, leading to high resistance or disconnection, especially in the TFT circuit and light-emitting pixel areas.
Innovation Solution
The semiconductor device incorporates lines with a core of resin material and conductive layers on either side, forming a structure where the insulating layer acts as a core and the conductive layers provide coverage, enhancing bending durability and reducing line resistance by increasing the cross-sectional area without the need for a protective member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional lines are used in flexible display devices, then the device can be manufactured with standard processes, but the lines are prone to breakage and loss of conductivity when folded
Solution Approach 1:
The line is constructed as a composite structure with a resin core and conductive layer, combining the flexibility and deformation resistance of resin with the electrical conductivity of metal. This composite structure allows the line to maintain both mechanical durability during bending and electrical conductivity, resolving the contradiction between reliability and strength.
Solution Approach 2:
The invention transitions from a conventional planar conductive line to a three-dimensional structure with a core and surrounding conductive layer. This dimensional change provides both mechanical support through the core and electrical conductivity through the conductive layer, simultaneously improving bending durability and maintaining conductivity.
2Reliability
If the cross-sectional area of lines is increased to reduce resistance, then line resistance decreases, but the device size increases
Solution Approach 1:
The composite structure with resin core and conductive layer achieves a high effective cross-sectional area for conductivity without proportionally increasing the overall line diameter. The resin core provides structural support while the conductive layer provides electrical pathways, reducing resistance without excessive size increase.
Solution Approach 2:
The thin conductive layer wrapped around the resin core provides sufficient conductive cross-section area to reduce line resistance while maintaining a compact overall structure. This thin-film approach allows high conductivity without significantly increasing device footprint.
3Reliability
If protective members are added to prevent line breakage, then bending durability improves, but device complexity and size increase
Solution Approach 1:
The protective function is merged with the conductive line structure itself. The resin core serves dual purposes: as the structural backbone providing bending durability and as part of the conductive pathway. This integration eliminates the need for separate protective members, reducing device complexity while maintaining line integrity.
Solution Approach 2:
The resin core performs multiple functions simultaneously: providing mechanical strength for bending durability, serving as an insulating layer, and acting as a structural support for the conductive layer. This multi-functionality reduces the need for additional protective components.
Data Source
AI summary
A semiconductor device includes a substrate having an insulating surface; a circuit including a transistor provided on the insulating surface and including a semiconductor layer, an insulating layer and a conductive layer; and a line provided on the insulating surface, the line extending in a first direction. The line includes a core containing a resin material and a conductive portion covering the core as seen in a cross-sectional view taken along a second direction crossing the first direction.