Resin Layer Plan View Pattern for Semiconductor Package Warping
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Solution Overview
Problem
Conventional Package-on-Package (PoP) technology faces challenges in suppressing warping of semiconductor packages due to thermal expansion differences between the board and semiconductor chip, leading to bonding failures and reduced reliability, especially with increasing demands for thinner and faster semiconductor devices.
Innovation Solution
A semiconductor device configuration featuring a first resin layer and a second resin layer with differing plan view patterns, where the second resin layer extends more towards the corners than the edges, creating a downward force at corners and upward force at edges to cancel warping stress, thereby suppressing smile warping and enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer resin structure is used to cover the semiconductor chip, then the manufacturing process is simple, but warping occurs due to thermal expansion differences between the board and semiconductor chip
Solution Approach 1:
The resin layer is divided into two distinct layers: a first resin layer directly covering the semiconductor chip and a second resin layer covering the first resin layer. This segmentation allows each layer to have different plan view patterns optimized for specific functions, with the first layer suppressing warping and the second layer providing overall protection, thereby resolving the contradiction between structural simplicity and bonding reliability.
Solution Approach 2:
The first resin layer is designed with a plan view pattern that differs from the second resin layer, creating local quality variations. The first layer's pattern is specifically configured to suppress warping at critical bonding regions, while the second layer provides uniform protection. This local differentiation enables targeted warping suppression without requiring complete structural redesign.
2Ease of manufacture
If the resin layer extends uniformly across the entire chip area, then manufacturing is easier, but warping cannot be suppressed effectively
Solution Approach 1:
The first resin layer is designed with an asymmetric plan view pattern that does not uniformly cover the semiconductor chip area. Instead, it extends to specific regions optimized for warping suppression, creating an asymmetric distribution that counteracts thermal expansion differences. This asymmetric design effectively suppresses warping while remaining manufacturable through standard molding processes.
3Length of moving object
If conventional single-layer resin structure is used, then device thickness can be reduced, but bonding failures occur due to warping
Solution Approach 1:
The solution transitions from a single-layer resin structure to a two-layer resin structure with different plan view patterns. This dimensional change in the resin layer configuration (from one layer to two layers with different patterns) enables effective warping suppression while maintaining compact device thickness, thereby preventing bonding failures without significantly increasing overall device size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses warping and improves bonding reliability in PoP structures by balancing thermal expansion stresses, addressing the limitations of existing technologies.
Implementation Method 1
The warping is mainly ascribable to difference in coefficient of thermal expansion between the board and the semiconductor chip
Data Source
AI summary
A resin layer covering a semiconductor chip on a wiring board is composed of a first resin layer and a second resin layer, wherein the first resin layer and the second resin layer differ in their plan view pattern, satisfying a relation of a<b, where "a" is difference in length in the direction from the center of the board towards the edges between the first resin layer and the second resin layer, and "b" is difference in length in the direction from the center of the board towards the corners between the first resin layer and the second resin layer.