Resin-Enclosed Lead Terminal Structure for Demolding Insulation
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Solution Overview
Problem
Existing semiconductor apparatuses face high rates of defective units during manufacturing due to issues with insulation and mold interaction during the resin enclosure process, which can lead to unreliable connections and stripped lead terminals.
Innovation Solution
The semiconductor apparatus includes a resin enclosure with inner wall portions and covering portions that enclose the lead terminals, ensuring reliable insulation and preventing mold interaction, thereby stabilizing connections and reducing defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead terminals are exposed in the resin enclosure, then electrical connection is enabled, but insulation reliability deteriorates and mold interaction occurs during demolding
Solution Approach 1:
The resin enclosure is segmented into distinct functional regions: an inner wall portion that defines the semiconductor chip mounting space and a covering portion that specifically covers the lead terminal. This segmentation allows the lead terminal to remain exposed for electrical connection while other portions are covered for insulation and mold release protection.
Solution Approach 2:
The resin enclosure exhibits local quality variations through the covering portion that provides insulation and protection specifically where needed (around the lead terminal), while the inner wall portion remains open to allow electrical connection. This localized differentiation resolves the contradiction between needing exposure for connection and coverage for insulation.
2Reliability
If lead terminals are fully covered for insulation, then insulation reliability improves, but electrical connection capability deteriorates
Solution Approach 1:
The covering portion is segmented to cover only specific regions of the lead terminal assembly, leaving the connection-critical portions exposed. This selective coverage maintains insulation reliability while preserving electrical connection capability.
Solution Approach 2:
The resin enclosure provides localized insulation coverage that differentiates between areas requiring electrical connection (exposed) and areas requiring insulation (covered). This local quality approach resolves the contradiction by providing insulation only where it does not interfere with electrical connection.
3Ease of manufacture
If lead terminals are exposed during molding, then manufacturing is simplified, but lead terminals are stripped during demolding
Solution Approach 1:
The covering portion is formed as an integral part of the resin enclosure during the molding process, preliminarily protecting the lead terminal before demolding occurs. This preliminary protective action prevents stripping during the subsequent demolding operation while maintaining manufacturing simplicity.
Solution Approach 2:
The covering portion acts as a cushioning protective layer formed beforehand during molding, shielding the lead terminal from mechanical stress during demolding. This beforehand protection prevents lead terminal stripping while keeping the molding process straightforward.
4Adaptability or versatility
If electronic components are mounted on lead terminals, then device integration is improved, but insulation reliability deteriorates
Solution Approach 1:
The covering portion provides localized insulation around the lead terminal assembly, maintaining insulation reliability even when electronic components are mounted on the lead terminals. This local quality approach allows device integration while preserving electrical insulation where critical.
Data Source
AI summary
A resin enclosure includes: an inner wall portion from a wall surface defining the space to a side surface of the lead terminal close to the space; and a covering portion that covers at least a part of a top surface of a first portion of the lead terminal.