Radiation-Sensitive Resin Composition for MEEF Reduction
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Solution Overview
Problem
Current radiation-sensitive resin compositions used in microfabrication face challenges in maintaining excellent sensitivity and reducing the mask error factor (MEEF) for achieving precise pattern transfer in semiconductor devices, especially at sub-65 nm line widths.
Innovation Solution
A radiation-sensitive resin composition is developed, comprising specific resin components with repeating units and a radiation-sensitive acid generator, where the total content of these units exceeds 80 mol%, optimizing the content range to suppress acid diffusion during heat treatment, thereby enhancing sensitivity and reducing MEEF.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional radiation-sensitive resin compositions are used to achieve high sensitivity, then sensitivity is improved, but the mask error factor (MEEF) increases
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by specifying precise mol% ranges for norbornane derivative units (30-90 mol%) and other repeating units (10-70 mol%), thereby optimizing the balance between sensitivity and MEEF
Solution Approach 2:
The patent uses a composite resin system combining norbornane derivative units with other specific repeating units (including cycloaliphatic units, aromatic units, or heterocyclic units) to achieve both high sensitivity and reduced MEEF
2Reliability
If the resin composition is optimized for sensitivity, then sensitivity is improved, but acid diffusion during heat treatment increases
Solution Approach 1:
The patent optimizes the chemical structure parameters by controlling the mol% content of specific repeating units to enhance film density and suppress acid diffusion while maintaining sensitivity
Solution Approach 2:
The patent uses acid-dissociable functional groups that generate acid upon irradiation, creating a self-contained chemical system that prevents external acid diffusion while maintaining internal chemical activity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves favorable sensitivity and a reduced MEEF, ensuring accurate pattern reproduction and improved microfabrication capabilities for deep ultraviolet rays, such as ArF excimer laser light, while maintaining film density to prevent acid diffusion.
Implementation Method 1
a component that generates an acid upon irradiation
Implementation Method 2
the total content of the repeating unit shown by the formula (1-1) and the repeating unit shown by the formula (1-2) in the resin (A1) being more than 80 mol %, and the content of the repeating unit shown by the formula (1-1) in the resin (A1) being more than 30 mol % and 90 mol % or less
Data Source
AI summary
A radiation-sensitive resin composition includes a resin (A1) that includes a repeating unit shown by the following formula (1-1) and a repeating unit shown by the following formula (1-2), and a radiation-sensitive acid generator (B). The radiation-sensitive resin composition exhibits excellent sensitivity, and can reduce a mask error factor (MEEF).wherein R1, R2, and R3 individually represent a linear or branched alkyl group having 1 to 4 carbon atoms, R4 represents a hydrogen atom, a linear or branched alkyl group having 2 to 4 carbon atoms, a linear or branched fluoroalkyl group having 1 to 4 carbon atoms, or a linear or branched alkoxy group having 1 to 4 carbon atoms, and q represents an integer from 0 to 3.