Resin Multilayer Substrate Bending via Triplate and Microstrip Segmentation

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Solution Overview

Problem

Resin multilayer substrates with triplate lines face challenges in bending due to overlapping grounding conductors, leading to excessive stress and degradation of transmission characteristics, making it difficult to accommodate the shape of smaller electronic devices.

Innovation Solution

A resin multilayer substrate design featuring a triplate line with a microstrip line that allows for easy bending by positioning the microstrip line where the substrate is bent, reducing stress on grounding conductors and maintaining transmission characteristics through strategic placement and width adjustments of the line conductor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the resin multilayer substrate includes a triplate line with grounding conductors on both sides, then the transmission characteristics are improved and noise resistance is enhanced, but the substrate becomes difficult to bend and excessive stress occurs on the grounding conductors

Engineering Contradiction:

Improvetransmission characteristicsVSAvoidbendability

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The substrate is divided into different line sections: triplate line sections with grounding conductors on both sides for high-frequency signal transmission, and microstrip line sections with grounding conductors on only one side for bending regions. This segmentation allows different areas to serve different functions, maintaining transmission quality where needed while enabling flexibility where required.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different structural configurations are applied to different parts of the substrate. The triplate line sections have grounding conductors on both sides for optimal transmission characteristics, while the microstrip line sections have grounding conductors on only one side to reduce stress during bending. This local differentiation resolves the contradiction between transmission quality and bendability.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the grounding conductors are made wider to improve noise resistance, then the shielding effect is enhanced, but the substrate becomes more rigid and harder to bend

Engineering Contradiction:

Improvenoise resistanceVSAvoidrigidity

Core Design Contradiction:

Object-affected harmful factorsVSStrength

Solution Approach 1:

The grounding conductor structure is segmented into different configurations: wider grounding conductors in triplate line sections for noise resistance, and reduced or single-sided grounding conductors in microstrip line sections for flexibility. This allows the substrate to achieve noise resistance where needed without overall rigidity increase.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9692100B2Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections

Publication Date: 2017.06.27 MURATA MFG CO LTD

AI summary

A flat cable includes a plurality of resin layers that are flexible and stacked together, a line conductor, and grounding conductors. The flat cable includes a triplate line in which both surfaces of the line conductor oppose the corresponding grounding conductors, and a microstrip line in which only one of the surfaces of the line conductor opposes the corresponding grounding conductor. A width of the line conductor in the microstrip line is greater than a width of the line conductor in the triplate line, and the flat cable is bent at a position where the microstrip line is provided.