Resin Multilayer Substrate Thermocompression Bonding
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Solution Overview
Problem
In resin multilayer substrates, the thermocompression bonding process often results in insufficient joining of resin layers near conductor patterns and cavities due to inadequate heat and pressure transfer, leading to non-joined states.
Innovation Solution
Incorporating a resin portion made of thermoplastic resin powder, specifically liquid crystal polymer, adjacent to conductor patterns and cavities, which fills gaps and enhances joining by evaporating the liquid component during bonding, thereby reducing non-joined states.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermocompression bonding is performed on stacked resin layers with embedded components, then components are successfully embedded in the substrate, but resin layers become insufficiently joined in portions directly below the embedded components due to inadequate heat and pressure transfer
Solution Approach 1:
The patent applies local quality by introducing a resin portion with different properties (made of thermoplastic resin powder) in specific locations directly below conductor patterns where joining is insufficient. This localized modification allows the resin portion to receive heat and pressure more effectively during thermocompression bonding, improving joining strength in critical areas without changing the entire substrate structure.
Solution Approach 2:
The resin portion acts as an intermediary between the conductor pattern and the underlying resin layers. It facilitates better heat and pressure transfer from the conductor pattern area to the resin layers below, enabling sufficient thermocompression bonding in regions that would otherwise remain poorly joined.
2Productivity
If thermocompression bonding is performed on stacked resin layers, then resin layers are joined together, but non-joined states occur in portions directly below cavities due to insufficient heat and pressure transfer
Solution Approach 1:
The patent addresses the cavity problem by placing resin portions in specific locations directly below cavities where joining is insufficient. These localized resin portions have different thermal and pressure conduction properties that enable adequate joining in cavity regions during thermocompression bonding, without requiring changes to the entire bonding process.
3Adaptability or versatility
If resin layers are stacked with conductor patterns and components, then functional substrate structure is achieved, but non-joined states occur between resin layers in portions adjacent to conductor patterns due to insufficient heat and pressure transfer
Solution Approach 1:
The patent introduces resin portions in specific locations adjacent to conductor patterns where joining is insufficient. These localized modifications allow the resin portion to act as a heat and pressure conduit, receiving energy from the conductor pattern area and transferring it to the underlying resin layers, thereby achieving adequate joining strength while preserving the functional substrate structure.
Solution Approach 2:
The resin portion serves as an intermediary structure between the conductor pattern and the resin layers below it. It mediates the heat and pressure transfer process, ensuring that sufficient energy reaches the resin layers in areas that would otherwise experience inadequate joining due to the presence of conductor patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin portion effectively reduces or prevents non-joined states between resin layers by ensuring adequate heat and pressure transfer during thermocompression bonding, improving the strength and coplanarity of the substrate.
Implementation Method 1
a resin portion (15) made of a resin paste including thermoplastic resin powder, for example, liquid crystal polymer powder, as a main material
Implementation Method 2
The liquid component of the resin paste does not substantially remain in the resin portion (15)
Implementation Method 3
heat and pressure by pressing in a thermocompression bonding step is not sufficiently transferred to this insufficiently joined portion
Data Source
AI summary
A resin multilayer substrate includes a stacked body including resin layers, a component, one or more first conductor patterns, and one or more second conductor patterns each disposed in a gap between the resin layers. At least a portion of an outline of each of the one or more first conductor patterns overlaps with the component. An outline of each of the one or more second conductor patterns does not overlap with the component. A resin portion is adjacent to each of the one or more first conductor patterns along a portion of the outline of each of the one or more first conductor patterns that overlaps with the component. The resin portion is made of a resin paste including thermoplastic resin powder as a main material. The resin portion is not disposed in a portion along the outline of each of the one or more second conductor patterns.