Curable Resin Composition Nanoparticle Dispersion Stability
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Solution Overview
Problem
The challenge is to develop a curable resin composition for optical semiconductor apparatuses that maintains stable color rendering properties by preventing phosphor particle precipitation during the sealing process, especially in low viscosity resin compositions, while also providing high thermal shock resistance and gas barrier properties.
Innovation Solution
A curable resin composition is formulated with phosphor particles and nanoparticles of specific sizes, along with silicone powder, to inhibit phosphor particle movement and precipitation, ensuring consistent phosphor content throughout the process. This composition includes a combination of silicone resin, epoxy resin, and nanoparticles, with a hydrosilylation catalyst for crosslinking, and specific additives for enhanced thermal resistance and gas barrier properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If phosphor particles are added to a curable resin composition with low viscosity, then the resin composition can be easily filled and operated, but the phosphor particles precipitate over time due to density difference
Solution Approach 1:
The patent changes the physical state parameter of phosphor particles by converting them from micro-scale particles to nano-scale particles (1-100 nm). This size reduction fundamentally alters the density relationship between phosphor and resin, preventing precipitation while maintaining low viscosity for easy filling operations.
Solution Approach 2:
The patent creates a composite material system where nanoscale phosphor particles are dispersed in the curable resin composition. This composite structure combines the benefits of low viscosity resin with uniform phosphor distribution, achieving both ease of operation and compositional stability.
2Illumination intensity
If phosphor particles are added to achieve desired color rendering properties, then the optical performance is improved, but the phosphor content varies between early and late stages of fabrication
Solution Approach 1:
The patent changes the size parameter of phosphor particles to nanoscale (1-100 nm), which eliminates the density-driven segregation that causes phosphor content variation during fabrication. This ensures consistent phosphor distribution from early to late stages of the filling process.
3Illumination intensity
If conventional phosphor materials with high density are used, then the light-wavelength transformation function is achieved, but the phosphor precipitates to the bottom of the container
Solution Approach 1:
The patent fundamentally changes the size parameter of phosphor particles from micro-scale to nanoscale (1-100 nm). This parameter change reduces the density difference between phosphor and resin, preventing gravitational precipitation while preserving the light-wavelength transformation function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents phosphor particle precipitation, maintains consistent color rendering properties, and provides high resistance to thermal shock and gas transmission, ensuring the stability and performance of optical semiconductor apparatuses.
Implementation Method 1
nanoparticles are dispersed in the form of secondarily aggregated particles
Implementation Method 2
the precipitation of phosphor over time during the sealing process
Implementation Method 3
a hydrosilylation catalyst for crosslinking
Implementation Method 4
is hardened to fabricate an optical semiconductor apparatus
Data Source
AI summary
A curable resin composition to which at least phosphor particles and nanoparticles having a primary particle size of 1 nm or more and less than 100 nm are added, wherein the nanoparticles are dispersed in the form of secondarily aggregated particles having an average particle size of 100 nm or more and 20 μm or less in terms of volume Q3 is provided for an optical semiconductor apparatus in which when a sealant obtained by dispersing phosphor particles in a curable resin composition having a low viscosity is filled into a package substrate, the dispersion state of the phosphor particles is not changed at the early and late stages of the fabrication, specifically the amounts of the phosphor particles to be contained at the early and late stages are the same, and the color rendering property can be stably maintained, a hardened material thereof, and an optical semiconductor apparatus.