Resin Package Light Distribution Control via Thickness Variation
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Solution Overview
Problem
Current semiconductor light emitting devices face challenges in efficiently controlling light distribution at a low cost, which is essential for widespread applications, as the cost of forming enclosures for different light distributions is high.
Innovation Solution
A semiconductor light emitting device is manufactured using a method that involves a metal plate with alternating first and second frames, where a light emitting element is connected to the second frame via a metal wire, and a resin package is formed with a first resin covering the element and frames, and a second resin covering the outer edge to control light distribution by varying the thickness and reflective material in the second resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an enclosure is formed to control light distribution, then light distribution control is improved, but manufacturing cost increases
Solution Approach 1:
The patent changes the physical parameters of the resin package by varying its thickness in different regions (thinner at edges, thicker at center) and by controlling the concentration of reflective materials within the resin. This allows the resin package itself to function as a light distribution control element, replacing the need for complex separate enclosures while achieving desired light patterns.
Solution Approach 2:
The patent uses composite resin materials that combine transparent resin with reflective particles or layers. This composite structure enables the resin package to simultaneously provide protection, light transmission, and light distribution control functions, eliminating the need for separate enclosure components and reducing manufacturing cost.
2Adaptability or versatility
If different enclosures are formed for different light distributions, then adaptability to applications is improved, but manufacturing cost increases
Solution Approach 1:
The patent creates a flexible resin package structure where the thickness and reflective material concentration can be dynamically adjusted during manufacturing to produce different light distribution patterns. This allows a single manufacturing process to produce multiple light distribution characteristics (omnidirectional, directional, focused) by simply changing process parameters rather than creating different enclosure molds.
Solution Approach 2:
The resin package is designed to perform multiple functions: protecting the light emitting element, transmitting light, and controlling light distribution. By making the resin package itself multi-functional, the patent eliminates the need for separate enclosures and enables a single component to adapt to various application requirements through parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective control of light distribution characteristics, making the semiconductor light emitting device adaptable to various applications by adjusting the thickness and reflective properties of the resin package.
Implementation Method 1
a second resin covering an outer edge of the first resin and reflecting light emitted by the light emitting element
Data Source
AI summary
According to one embodiment, a method for manufacturing a semiconductor light emitting device includes: preparing a metal plate including first frames and second frames, the first frames and the second frames being alternately arranged and spaced from each other, a light emitting element being fixed to each of the first frames, the light emitting element being connected to an adjacent one of the second frames via a metal wire; molding a first resin on the metal plate, the first resin covering the first frame, the second frame, and the light emitting element; forming in the first resin a groove defining a resin package including the first frame, the second frame, and the light emitting element; filling a second resin inside the groove; and forming the resin package with an outer edge of the first resin covered with the second resin by cutting the second resin along the groove.